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浏览/检索结果: 共3条，第1-3条 帮助 限定条件 发表日期：2022     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Iodide-induced galvanic replacement of nickel film on copper as activator for electroless nickel-phosphorus plating 期刊论文 Materials Letters, 2022, 卷号: 314 作者:  Zhao, Qiuping;  Hu, Guanqun;  Huang, Rui;  Qiang, Li;  Zhang, Xingkai 收藏  |  浏览/下载：17/0  |  提交时间：2022/04/21 Copper compounds  Copper corrosion  Corrosion resistance  Corrosion resistant coatings  Deposition  Metal ions  Metallic films  Morphology  Precious metals  Copper ions  Electrode potentials  Electroless nickel-phosphorus plating  Galvanic replacements  Iodide  Iodide solution  Nickel film  Replacement methods  Replacement rates  Thin-films   Facile galvanic replacement deposition of nickel on copper substrate in deep eutectic solvent and its activation ability for electroless Ni–P plating 期刊论文 Journal of Solid State Electrochemistry, 2022, 卷号: 26, 期号: 5, 页码: 1313-1322 作者:  Hu, Guanqun;  Huang, Rui;  Wang, Hongli;  Zhao, Qiuping;  Zhang, Xingkai 收藏  |  浏览/下载：37/0  |  提交时间：2022/06/20 Chlorine compounds  Corrosion resistance  Electroless plating  Eutectics  Metallic films  Morphology  Nickel  Nickel coatings  Nickel compounds  Nickel plating  Palladium  Phosphorus  Solvents  Surface morphology  Surface treatment  Activation ability  Copper substrates  Deep eutectic solvents  Electroless Ni-P  Electroless nickel-phosphorus plating  Galvanic replacement deposition  Galvanic replacements  Nickel film  Nickel phosphorus  Palladium films   Facile galvanic replacement deposition of nickel on copper substrate in deep eutectic solvent and its activation ability for electroless Ni–P plating 期刊论文 Journal of Solid State Electrochemistry, 2022, 期号: 26, 页码: 1313–1322 作者:  Guanqun Hu;  Rui Huang;  Hongli Wang;  Qiuping Zhao;  Xingkai Zhang 收藏  |  浏览/下载：6/0  |  提交时间：2022/12/12