Iodide-induced galvanic replacement of nickel film on copper as activator for electroless nickel-phosphorus plating

doi:10.1016/j.matlet.2022.131833

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	Iodide-induced galvanic replacement of nickel film on copper as activator for electroless nickel-phosphorus plating
	Zhao, Qiuping 2; Hu, Guanqun 1,2; Huang, Rui 3; Qiang, Li 1; Zhang, Xingkai 1
刊名	Materials Letters
	2022-05-01
卷号	314
关键词	Copper compounds Copper corrosion Corrosion resistance Corrosion resistant coatings Deposition Metal ions Metallic films Morphology Precious metals Copper ions Electrode potentials Electroless nickel-phosphorus plating Galvanic replacements Iodide Iodide solution Nickel film Replacement methods Replacement rates Thin-films
ISSN号	0167-577X
DOI	10.1016/j.matlet.2022.131833
英文摘要	Galvanic replacement provides a convenient route to synthesize metallic films and nanostructures. However, metals commonly reduce more noble metal ions. In this work, nickel film was deposited on copper through an iodide-assisted galvanic replacement method. It was found copper had a lower electrode potential than nickel in high concentration of iodide solution, so nickel film could be obtained through the unusual galvanic replacement. The experimental results revealed increasing iodide concentration was conducive to the galvanic replacement rate between copper and nickel ions, and complete nickel film could be obtained in solution with 1200 g·L−1 sodium iodide in 10 min. The as-prepared nickel film showed good activation ability for electroless nickel-phosphorus plating, for the nickel-phosphorus coatings obtained on the nickel and traditional palladium films possessed similar morphology, structure and corrosion resistance. © 2022 Elsevier B.V.
WOS研究方向	Materials Science ; Physics
语种	英语
出版者	Elsevier B.V.
WOS记录号	WOS:000766079800004
内容类型	期刊论文
源URL	[http://ir.lut.edu.cn/handle/2XXMBERH/157879]
专题	石油化工学院
作者单位	1.State Key Laboratory of Solid Lubrication, Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences, Lanzhou; 730000, China; 2.College of Petrochemical Technology, Lanzhou University of Technology, Lanzhou; 730050, China; 3.College of Physics and Electronic Engineering, Northwest Normal University, Lanzhou; 730070, China
推荐引用方式 GB/T 7714	Zhao, Qiuping,Hu, Guanqun,Huang, Rui,et al. Iodide-induced galvanic replacement of nickel film on copper as activator for electroless nickel-phosphorus plating[J]. Materials Letters,2022,314.
APA	Zhao, Qiuping,Hu, Guanqun,Huang, Rui,Qiang, Li,&Zhang, Xingkai.(2022).Iodide-induced galvanic replacement of nickel film on copper as activator for electroless nickel-phosphorus plating.Materials Letters,314.
MLA	Zhao, Qiuping,et al."Iodide-induced galvanic replacement of nickel film on copper as activator for electroless nickel-phosphorus plating".Materials Letters 314(2022).