Facile galvanic replacement deposition of nickel on copper substrate in deep eutectic solvent and its activation ability for electroless Ni–P plating

CORC > 兰州化学物理研究所 > 中国科学院兰州化学物理研究所 > 先进润滑与防护材料研究发展中心

	Facile galvanic replacement deposition of nickel on copper substrate in deep eutectic solvent and its activation ability for electroless Ni–P plating
	Guanqun Hu 3,4; Rui Huang 2; Hongli Wang 1; Qiuping Zhao 3; Xingkai Zhang 4
刊名	Journal of Solid State Electrochemistry
	2022-04-19
期号	26 页码:1313–1322
语种	英语
内容类型	期刊论文
源URL	[http://ir.licp.cn/handle/362003/29660]
专题	兰州化学物理研究所_先进润滑与防护材料研究发展中心
通讯作者	Xingkai Zhang
作者单位	1.State Key Laboratory for Oxo Synthesis and Selective Oxidation, Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences 2.College of Physics and Electronic Engineering, Northwest Normal University 3.College of Petrochemical Technology, Lanzhou University of Technology 4.Key Laboratory of Science and Technology On Wear and Protection of Materials, Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences
推荐引用方式 GB/T 7714	Guanqun Hu,Rui Huang,Hongli Wang,et al. Facile galvanic replacement deposition of nickel on copper substrate in deep eutectic solvent and its activation ability for electroless Ni–P plating[J]. Journal of Solid State Electrochemistry,2022(26):1313–1322.
APA	Guanqun Hu,Rui Huang,Hongli Wang,Qiuping Zhao,&Xingkai Zhang.(2022).Facile galvanic replacement deposition of nickel on copper substrate in deep eutectic solvent and its activation ability for electroless Ni–P plating.Journal of Solid State Electrochemistry(26),1313–1322.
MLA	Guanqun Hu,et al."Facile galvanic replacement deposition of nickel on copper substrate in deep eutectic solvent and its activation ability for electroless Ni–P plating".Journal of Solid State Electrochemistry .26(2022):1313–1322.