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浏览/检索结果: 共6条，第1-6条 帮助 限定条件 专题：大连理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Process development and reliability for wafer-level 3D IC integration using micro-bump/adhesive hybrid bonding and via-last TSVs 会议论文 19th International Conference on Electronic Packaging Technology, ICEPT 2018, Shanghai, China, 2018-08-08 作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao 收藏  |  浏览/下载：14/0  |  提交时间：2019/12/02 Process development and reliability for wafer-level 3D IC integration using micro- bump/adhesive hybrid bonding and via-last TSVs 会议论文 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01 作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao 收藏  |  浏览/下载：10/0  |  提交时间：2019/12/02 3D IC  wafer-level hybrid bonding  insert Cu pillar solder bump  dry film adhesive  TSVs  reliability   Optimization and Characterization of Low-Temperature Wafer-Level Hybrid Bonding Using Photopatternable Dry Film Adhesive and Symmetric Micro Cu Pillar Solder Bumps 期刊论文 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 页码: 1855-1862 作者:  Yao, Mingjun;  Zhao, Ning;  Wang, Teng;  Yu, Daquan;  Xiao, Zhiyi 收藏  |  浏览/下载：13/0  |  提交时间：2019/12/02 3-D IC  bump  dry film adhesive  wafer-level hybrid bonding   Solid-State-Diffusion Bonding for Wafer-Level Fine-Pitch Cu/Sn/Cu Interconnect in 3-D Integration 期刊论文 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2017, 卷号: 7, 页码: 19-26 作者:  Wang, Junqiang;  Wang, Qian;  Wu, Zijian;  Wang, Dejun;  Cai, Jian 收藏  |  浏览/下载：11/0  |  提交时间：2019/12/02 Cu/Sn/Cu interconnect  fine-pitch interconnect  solid-state-diffusion (SSD) bonding  wafer-level bonding   DEVELOPMENT OF WAFER LEVEL HYBRID BONDING PROCESS USING PHOTOSENSITIVE ADHESIVE AND CU PILLAR BUMP 会议论文 China Semiconductor Technology International Conference (CSTIC), Shanghai, PEOPLES R CHINA, 2017-03-12 作者:  Yao, Mingjun;  Yu, Daquan;  Zhao, Ning;  Fan, Jun;  Xiao, Zhiyi 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/02 Hybrid bonding  3D packaging  Bump  Polyimide  Dry film   Drop Failure Modes of A Wafer-Level Chip-Scale Packaging 会议论文 14th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Dalian, PEOPLES R CHINA, 2013-08-11 作者:  Huang, Mingliang;  Liu, Shuang;  Zhao, Ning;  Long, Haohui;  Li, Jianhui 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/11 Sn-3Ag-0.5Cu solder joint  board-level drop reliability  failure mode  wafer-level chip-scale packaging (WLCSP)  intermetallic compound (IMC)