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科研机构
兰州理工大学 [14]
内容类型
期刊论文 [14]
发表日期
2022 [1]
2020 [5]
2019 [4]
2018 [4]
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专题:兰州理工大学
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Research on Bi contents addition into Sn-Cu-based lead-free solder alloy
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2022, 卷号: 33, 期号: 19, 页码: 15586-15603
作者:
Huang, Hai
;
Chen, Bin
;
Hu, Xiaowu
;
Jiang, Xiongxin
;
Li, Qinglin
收藏
  |  
浏览/下载:88/0
  |  
提交时间:2022/07/19
Binary alloysCopper corrosionCorrosion protectionCorrosion resistanceCorrosion resistant alloysCorrosive effectsDifferential scanning calorimetryElectrochemical corrosionElectrochemical impedance spectroscopyLead alloysLead-free soldersPassivationScanning electron microscopySemiconductor dopingTensile strengthThermodynamic propertiesTin alloysVickers hardness
Cu-basedElectrochemicalsLead-free solder alloyMechanical performanceMechanical resistanceSolder alloysUndercoolingsUniversal testing machinesVicker hardnessX- ray diffractions
Effects of the Ni electrodeposit on microstructure evolution and electrical resistance of the P-type Bi2Te3 solder joint
期刊论文
Journal of Alloys and Compounds, 2020, 卷号: 832
作者:
Cheng, Jinxuan
;
Hu, Xiaowu
;
Li, Qinglin
收藏
  |  
浏览/下载:21/0
  |  
提交时间:2020/11/14
Bismuth compounds
Diffusion
Electric resistance
Electrodes
Growth rate
IV-VI semiconductors
Microstructure
Scanning electron microscopy
Tin
Tin compounds
Transmission electron microscopy
Diffusion process
Electrical resistances
Micro-structure evolutions
Porous structures
Thermodynamically stable
Thermoelectric
Volume diffusion
X ray diffractometers
Wetting of Ni-based amorphous and crystalline alloys by Sn and Sn-based solders
期刊论文
Microelectronics Reliability, 2020, 卷号: 111
作者:
Lin, Qiaoli
;
Ye, Changsheng
;
Sui, Ran
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2020/11/14
Amorphous alloys
Binary alloys
Copper alloys
Lead alloys
Nickel oxide
Oxide films
Silver alloys
Ternary alloys
Tin
Crystalline alloys
Interfacial reactivity
Minimum surfaces
Primary crystallization
Sn-based solders
Volume shrinkage
Wetting balance methods
Wetting mechanism
Effect of Co addition into Ni film on shear strength of solder/Ni/Cu system: Experimental and theoretical investigations
期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2020, 卷号: 788
作者:
Bi, Xiaoyang
;
Hu, Xiaowu
;
Li, Qinglin
收藏
  |  
浏览/下载:16/0
  |  
提交时间:2022/03/01
Solder joints
Ni-Co film
Shear strength
Atomic model
Intermetallic compound
First-principles calculations
Wettability of amorphous and crystalline Co73Si10B17 by lead-free solders
期刊论文
Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, 2020, 卷号: 30, 期号: 6, 页码: 1329-1337
作者:
Ye, Chang-Sheng
;
Ci, Wen-Juan
;
Lin, Qiao-Li
;
Sui, Ran
;
Wang, Jian-Bin
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2020/11/14
Binary alloys
Cobalt alloys
Copper alloys
Descaling
Free energy
Lead-free solders
Oxide films
Silicon
Silicon compounds
Silver alloys
Surface reactions
Ternary alloys
Tin
Wetting
Co-based alloys
Crystalline state
Sn-based solders
Surface free energy
Surface oxide films
Temperature range
Wetting balance methods
Wetting mechanism
Influence of additives on electroplated copper films and shear strength of SAC305/Cu solder joints
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2020, 卷号: 31, 期号: 3, 页码: 2320-2330
作者:
Zhang, Xudong
;
Hu, Xiaowu
;
Jiang, Xiongxin
;
Zhou, Liuru
;
Li, Qinglin
收藏
  |  
浏览/下载:11/0
  |  
提交时间:2020/06/16
Additives
Atomic force microscopy
Binary alloys
Chlorine compounds
Copper
Copper compounds
Electron probe microanalysis
Electrons
High resolution transmission electron microscopy
Metallic films
Scanning electron microscopy
Tin alloys
Tin metallography
X ray photoelectron spectroscopy
Crystallographic orientations
Electron back scatter diffraction
Electroplated copper film
Electroplated Cu films
Impurity incorporation
Micro-structural characterization
Microstructural instability
Plating solutions
Investigations on elastic properties and electronic structures of alpha-CoSn3 doped with Ni via first-principles calculations and nano-indentation measurements
期刊论文
RESULTS IN PHYSICS, 2019, 卷号: 15
作者:
Bi, Xiaoyang
;
Hu, Xiaowu
;
Li, Qinglin
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2022/03/01
Intermetallic compound
Nano-indentation
First-principles calculations
Mechanical properties
Effects of aluminum addition (x=0-1 wt%) on the thermal behavior, microstructure and mechanical properties of Zn-30Sn high temperature lead-free solder alloy
期刊论文
MATERIALS RESEARCH EXPRESS, 2019, 卷号: 6, 期号: 8
作者:
Li, Jiayin
;
Hu, Xiaowu
;
Zhang, Xudong
;
Li, Qinglin
收藏
  |  
浏览/下载:11/0
  |  
提交时间:2019/11/15
Zn-Sn alloys
mechanical properties
fracture analysis
microstructure refinement
Effects of aluminum addition (x = 0-1 wt%) on the thermal behavior, microstructure and mechanical properties of Zn-30Sn high temperature lead-free solder alloy
期刊论文
Materials Research Express, 2019, 卷号: 6, 期号: 8
作者:
Li, Jiayin
;
Hu, Xiaowu
;
Zhang, Xudong
;
Li, Qinglin
收藏
  |  
浏览/下载:0/0
  |  
提交时间:2020/11/14
Aluminum
Binary alloys
Ductile fracture
Eutectics
Fracture mechanics
Lead-free solders
Mechanical properties
Microstructure
Tensile strength
Ternary alloys
Tin alloys
Eutectic structures
Fracture analysis
Lead-free solder alloy
Microstructure and mechanical properties
Microstructure refinement
Peritectic reaction
Ultimate tensile strength
Zn-Sn alloys
Effect of Cu additions on mechanical properties of Ni3Sn4-based intermetallic compounds: First-principles calculations and nano-indentation measurements
期刊论文
VACUUM, 2019, 卷号: 164, 页码: 7-14
作者:
Bi, Xiaoyang
;
Hu, Xiaowu
;
Jiang, Xiongxin
;
Li, Qinglin
收藏
  |  
浏览/下载:10/0
  |  
提交时间:2019/11/15
Intermetallic compounds
Nano-indentation
First-principles calculations
Mechanical properties
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