中国开放科研知识云: 检索

验证码:

换一张

忘记密码？记住我

取消登录

CORC

首页
科研机构
检索
知识图谱
申请加入
托管服务

在结果中检索

科研机构

兰州理工大学 [173]

内容类型

期刊论文 [128]

学位论文 [35]

会议论文 [4]

发表日期

知识图谱

CORC

已提交作品

待认领作品

已认领作品

未提交全文

浏览/检索结果: 共173条，第1-10条

帮助

限定条件	专题：兰州理工大学第一署名单位第一作者单位通讯作者单位

已选(0)清除条数/页：排序方式：
	Study of the dynamic wetting behavior of Sn droplet impacting Cu substrate 期刊论文 APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 2022, 卷号: 128, 期号: 8 作者: Yu, Weiyuan; Wang, Mingkang; Wang, Fengfeng; Wang, Xiwushan; Wu, Baolei 收藏 \| 浏览/下载：17/0 \| 提交时间：2022/07/19 Droplet impaction Droplet solidification Dynamic wetting behavior Thermal spraying Jet formation
	Research on Bi contents addition into Sn-Cu-based lead-free solder alloy 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2022, 卷号: 33, 期号: 19, 页码: 15586-15603 作者: Huang, Hai; Chen, Bin; Hu, Xiaowu; Jiang, Xiongxin; Li, Qinglin 收藏 \| 浏览/下载：88/0 \| 提交时间：2022/07/19 Binary alloysCopper corrosionCorrosion protectionCorrosion resistanceCorrosion resistant alloysCorrosive effectsDifferential scanning calorimetryElectrochemical corrosionElectrochemical impedance spectroscopyLead alloysLead-free soldersPassivationScanning electron microscopySemiconductor dopingTensile strengthThermodynamic propertiesTin alloysVickers hardness Cu-basedElectrochemicalsLead-free solder alloyMechanical performanceMechanical resistanceSolder alloysUndercoolingsUniversal testing machinesVicker hardnessX- ray diffractions
	Construction of a Cu-Sn Heterojunction Interface Derived from a Schottky Junction in Cu@Sn/rGO Composites as a Highly Efficient Dielectric Microwave Absorber (vol 13, pg 11911, 2021) 期刊论文 ACS APPLIED MATERIALS & INTERFACES, 2022, 卷号: 14, 期号: 20, 页码: 24070-24070 作者: Li, Tiantian; Xia, Long; Yang, Hua; Wang, Xinyu; Zhang, Tao 收藏 \| 浏览/下载：16/0 \| 提交时间：2022/07/19
	Spreading behavior of Sn droplets impacting Cu and stainless steel substrates 期刊论文 SURFACES AND INTERFACES, 2022, 卷号: 29 作者: Wang, Xiwushan; Yu, Weiyuan; Wang, Mingkang; Wang, Fengfeng; Wu, Baolei 收藏 \| 浏览/下载：15/0 \| 提交时间：2022/04/21 Metal droplets Droplet impinging Spreading Droplet diameter Contact angle
	超声振动和直流电耦合作用对润湿行为的影响（英文）期刊论文稀有金属材料与工程, 2022, 卷号: 51, 期号: 03, 页码: 800-805 作者: 孙学敏; 俞伟元; 王锋锋; 吴保磊; 王艳红收藏 \| 浏览/下载：11/0 \| 提交时间：2022/04/21 超声振动直流电润湿性金属间化合物驱动力
	Enthalpic interaction promotes the stability of high elastic Cu-Ni-Sn alloys 期刊论文 JOURNAL OF ALLOYS AND COMPOUNDS, 2022, 卷号: 896 作者: Li, Z. M.; Cheng, Z. L.; Li, X. N.; Hu, Y. L.; Li, N. J. 收藏 \| 浏览/下载：17/0 \| 提交时间：2022/03/01 Cu-Ni-Sn alloy Cluster-plus-glue-atom mode Enthalpic interaction Stability
	Effect of Ultrasonic Vibration Coupled with Direct Current on Wetting Behavior 期刊论文 Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2022, 卷号: 51, 期号: 3, 页码: 800-805 作者: Sun, Xuemin; Yu, Weiyuan; Wang, Fengfeng; Wu, Baolei; Wang, Yanhong 收藏 \| 浏览/下载：21/0 \| 提交时间：2022/06/20 Copper Intermetallics Nanocomposites Precipitation (chemical) Ultrasonic applications Ultrasonic waves Wetting Cu substrate Direct current method Direct-current Driving forces Intermetallics compounds Liquid solders Power current Ultrasonic-vibration Wetting balance Wetting behavior
	Compositional interpretation of high elasticity Cu–Ni–Sn alloys using cluster-plus-glue-atom model 期刊论文 Journal of Materials Research and Technology, 2022, 卷号: 17, 页码: 1246-1258 作者: Yang, M.; Hu, Y.L.; Li, X.N.; Li, Z.M.; Zheng, Y.H. 收藏 \| 浏览/下载：12/0 \| 提交时间：2022/04/21 Aluminum alloys Atoms Cobalt alloys Copper alloys Glues Precipitation (chemical) Solid solutions Spinodal decomposition Tin alloys Zinc alloys Atomic ratio Cluster-plus-glue-atom model Cu-Ni-Sn alloy Decomposition structures Discontinuous precipitation Glue atoms matrix Precipitated phase Segregation Solution content
	Enhanced mechanical properties and corrosion behavior of Zn-30Sn-2Cu high-temperature lead-free solder alloy by adding Sm 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2022, 卷号: 33, 期号: 9, 页码: 6469-6484 作者: Zhang, Huajin; Hu, Xiaowu; Liu, Yi; Zhang, Jiankang; Jiang, Xiongxin 收藏 \| 浏览/下载：28/0 \| 提交时间：2022/03/01 Corrosion resistance Corrosion resistant alloys Corrosive effects Ductile fracture Electrochemical impedance spectroscopy Galvanic corrosion High temperature corrosion Lead-free solders Morphology Tensile strength Zinc Zinc alloys Corrosion behaviour Electrochemical-impedance spectroscopies Fracture morphology Highest temperature Lead-free solder alloy Polarization impedance Potentiodynamics polarization Rich phase Sm addition Ultimate tensile strength
	Microstructure and tribological behaviors of diffusion bonded powder sintered Cu-Sn based alloys 期刊论文 MATERIALS RESEARCH EXPRESS, 2021, 卷号: 8, 期号: 11 作者: Li, Zhenyu; Zhao, Gengrui; Wang, Honggang; Gao, Gui; Chen, Shengsheng 收藏 \| 浏览/下载：20/0 \| 提交时间：2021/12/17 Cu alloy diffusion alloyed powder friction and wear third-body layer

相关链接
欧盟学术资源开放存取平台
CALIS高校机构知识库
台湾学术机构典藏
香港机构知识库整合系统
中国科学院机构知识库网格系统

CORC
关于我们
服务条款
隐私条款

联系我们
0931-8270076
cspace@llas.ac.cn
China-OR

中文简体

©版权所有 ©2017 CSpace - Powered by CSpace