中国开放科研知识云: 检索

验证码:

换一张

忘记密码？记住我

取消登录

CORC

首页
科研机构
检索
知识图谱
申请加入
托管服务

在结果中检索

科研机构

兰州理工大学 [66]

内容类型

期刊论文 [62]

会议论文 [4]

发表日期

知识图谱

CORC

已提交作品

待认领作品

已认领作品

未提交全文

浏览/检索结果: 共66条，第1-10条

帮助

限定条件	专题：兰州理工大学第一署名单位第一作者单位通讯作者单位

已选(0)清除条数/页：排序方式：
	Biomass-Assisted Synthesis of Tiny Tin Nanoparticles Embedded in Nitrogen/Oxygen Self-Doped Carbon Nanosheets as High Performance Anode Materials for Sodium-Ion Batteries 期刊论文 CHEMISTRYSELECT, 2022, 卷号: 7, 期号: 27 作者: Mou, Guizhen; He, Fangzhen; Lin, Yasu; Zhong, Ming; Su, Bitao 收藏 \| 浏览/下载：33/0 \| 提交时间：2022/08/09 biomass carbon electrochemistry tin nanoparticle sodium-ion battery
	Research on Bi contents addition into Sn-Cu-based lead-free solder alloy 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2022, 卷号: 33, 期号: 19, 页码: 15586-15603 作者: Huang, Hai; Chen, Bin; Hu, Xiaowu; Jiang, Xiongxin; Li, Qinglin 收藏 \| 浏览/下载：88/0 \| 提交时间：2022/07/19 Binary alloysCopper corrosionCorrosion protectionCorrosion resistanceCorrosion resistant alloysCorrosive effectsDifferential scanning calorimetryElectrochemical corrosionElectrochemical impedance spectroscopyLead alloysLead-free soldersPassivationScanning electron microscopySemiconductor dopingTensile strengthThermodynamic propertiesTin alloysVickers hardness Cu-basedElectrochemicalsLead-free solder alloyMechanical performanceMechanical resistanceSolder alloysUndercoolingsUniversal testing machinesVicker hardnessX- ray diffractions
	Effect of Sn on microstructure and properties of Ti-Zr-Nb-Sn medium-entropy alloys (MEAs) 期刊论文 JOURNAL OF MATERIALS RESEARCH, 2022, 卷号: 37, 期号: 10, 页码: 1762-1770 作者: Li, Taojun; Hu, Shiwen; Wang, Lidong; Jia, Zhi; Li, Qinglin 收藏 \| 浏览/下载：17/0 \| 提交时间：2022/06/21
	First-principles Study of Doped (Silicon, Germanium, Tin) Single-wall Carbon Nanotubes 期刊论文 Cailiao Daobao/Materials Reports, 2022, 卷号: 36, 期号: 9 作者: Lu, Xuefeng; Wang, Kuan; Cui, Zhihong 收藏 \| 浏览/下载：31/0 \| 提交时间：2022/06/20 Absorption spectroscopy Atoms Calculations Semiconductor doping Single-walled carbon nanotubes (SWCN) Solar cells Doped silicon Doped systems Electronic.structure First principles First-principle study Germanium tins Silicon germaniums (SiGe) Single Wall Single-wall carbon nanotube Sn-doped
	Analysis on phase nucleation in Sn-Ni peritectic alloy combining confocal laser scanning in-situ observation and differential scanning calorimetry 期刊论文 JOURNAL OF ALLOYS AND COMPOUNDS, 2022, 卷号: 898 作者: Peng, Peng; Chen, Weiqi; Xu, Yuanli; Zhang, Xudong; Li, Yuandong 收藏 \| 浏览/下载：21/0 \| 提交时间：2022/03/01 Peritectic solidification HT -CL SM DSC analysis Phase nucleation Wetting angle
	Sn-containing Si3N4-based composites for adaptive excellent friction and wear in a wide temperature range 期刊论文 JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, 2022, 卷号: 42, 期号: 3, 页码: 913-920 作者: Liu, Jiongjie; Dong, Changyu; Lu, Xuefeng; Qiao, Zhuhui; Zhou, Feng 收藏 \| 浏览/下载：24/0 \| 提交时间：2022/03/01 Si3N4 Ti2SnC Ceramic-matrix composites (CMCs) Tribological properties High temperature
	Enhanced mechanical properties and corrosion behavior of Zn-30Sn-2Cu high-temperature lead-free solder alloy by adding Sm 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2022, 卷号: 33, 期号: 9, 页码: 6469-6484 作者: Zhang, Huajin; Hu, Xiaowu; Liu, Yi; Zhang, Jiankang; Jiang, Xiongxin 收藏 \| 浏览/下载：28/0 \| 提交时间：2022/03/01 Corrosion resistance Corrosion resistant alloys Corrosive effects Ductile fracture Electrochemical impedance spectroscopy Galvanic corrosion High temperature corrosion Lead-free solders Morphology Tensile strength Zinc Zinc alloys Corrosion behaviour Electrochemical-impedance spectroscopies Fracture morphology Highest temperature Lead-free solder alloy Polarization impedance Potentiodynamics polarization Rich phase Sm addition Ultimate tensile strength
	Enhanced Antiwear Property of Cu-Sn-Bi Bimetal Composites with TiB2 under Different Working Conditions 期刊论文 TRIBOLOGY TRANSACTIONS, 2021, 卷号: 65, 期号: 1, 页码: 78-87 作者: Yang, Dongya; Li, Zhenyu; Zhao, Gengrui; Wang, Honggang; Ren, Junfang 收藏 \| 浏览/下载：29/0 \| 提交时间：2021/12/17 TiB2 CuSn10Bi3 powder metallurgy microstructure friction and wear
	Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid-liquid electromigration 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 卷号: 32, 期号: 13, 页码: 17336-17348 作者: Qiu, Hongyu; Xu, Han; Zhang, Chuge; Hu, Xiaowu; Jiang, Xiongxin 收藏 \| 浏览/下载：17/0 \| 提交时间：2021/10/14
	Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid–liquid electromigration 期刊论文 Journal of Materials Science: Materials in Electronics, 2021, 卷号: 32, 期号: 13, 页码: 17336-17348 作者: Qiu, Hongyu; Xu, Han; Zhang, Chuge; Hu, Xiaowu; Jiang, Xiongxin 收藏 \| 浏览/下载：12/0 \| 提交时间：2022/02/17 Binary alloys Copper alloys Electromigration Tensile strength Tin alloys Bonding joints Co content Coaddition Current direction Electric density Micro-structure evolutions Solder joints

相关链接
欧盟学术资源开放存取平台
CALIS高校机构知识库
台湾学术机构典藏
香港机构知识库整合系统
中国科学院机构知识库网格系统

CORC
关于我们
服务条款
隐私条款

联系我们
0931-8270076
cspace@llas.ac.cn
China-OR

中文简体

©版权所有 ©2017 CSpace - Powered by CSpace