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兰州理工大学 [34]

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限定条件	专题：兰州理工大学第一署名单位第一作者单位通讯作者单位

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	Facile galvanic replacement deposition of nickel on copper substrate in deep eutectic solvent and its activation ability for electroless Ni–P plating 期刊论文 Journal of Solid State Electrochemistry, 2022, 卷号: 26, 期号: 5, 页码: 1313-1322 作者: Hu, Guanqun; Huang, Rui; Wang, Hongli; Zhao, Qiuping; Zhang, Xingkai 收藏 \| 浏览/下载：37/0 \| 提交时间：2022/06/20 Chlorine compounds Corrosion resistance Electroless plating Eutectics Metallic films Morphology Nickel Nickel coatings Nickel compounds Nickel plating Palladium Phosphorus Solvents Surface morphology Surface treatment Activation ability Copper substrates Deep eutectic solvents Electroless Ni-P Electroless nickel-phosphorus plating Galvanic replacement deposition Galvanic replacements Nickel film Nickel phosphorus Palladium films
	Spreading behavior of Sn droplets impacting Cu and stainless steel substrates 期刊论文 SURFACES AND INTERFACES, 2022, 卷号: 29 作者: Wang, Xiwushan; Yu, Weiyuan; Wang, Mingkang; Wang, Fengfeng; Wu, Baolei 收藏 \| 浏览/下载：15/0 \| 提交时间：2022/04/21 Metal droplets Droplet impinging Spreading Droplet diameter Contact angle
	Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid–liquid electromigration 期刊论文 Journal of Materials Science: Materials in Electronics, 2021, 卷号: 32, 期号: 13, 页码: 17336-17348 作者: Qiu, Hongyu; Xu, Han; Zhang, Chuge; Hu, Xiaowu; Jiang, Xiongxin 收藏 \| 浏览/下载：12/0 \| 提交时间：2022/02/17 Binary alloys Copper alloys Electromigration Tensile strength Tin alloys Bonding joints Co content Coaddition Current direction Electric density Micro-structure evolutions Solder joints
	Wettability of GH4099 and MHC alloys by AgCuTi, TiZrCuTi and NiCrSiB filler metals and evaluation of diffusion-brazability 期刊论文 Journal of Manufacturing Processes, 2021, 卷号: 64, 页码: 1089-1097 作者: Che, Hongyan; Zheng, Tianming; Wang, Tiejun; Li, Wei; Lin, Qiaoli 收藏 \| 浏览/下载：16/0 \| 提交时间：2021/04/12 Chromium alloys Copper alloys Diffusion Diffusion bonding Filler metals Fillers Fracture mechanics Joining Molybdenum alloys Molybdenum compounds Nickel alloys Nickel compounds Silicon Silicon alloys Silver alloys Wetting Zircaloy Bonding strength Brazability Gleeble Interlayer materials NiCrSiB NiCrSiB filler metal Simulated experiments Welding joints
	Numerical Simulation of WAAM Temperature Field Under Water Cooling 期刊论文 Cailiao Daobao/Materials Reports, 2021, 卷号: 35, 期号: 4, 页码: 04165-04169 作者: Chen, Kexuan; Wang, Xiangyu; Li, Yizhao; Chen, Yanqiang; Du, Yinyin 收藏 \| 浏览/下载：3/0 \| 提交时间：2021/06/03 3D printers ABAQUS Additives Cooling Plate metal Substrates Temperature Average temperature gradients Dissipation methods Experimental conditions Measurement points Simulation process Substrate temperature Temperature field change Thermal cycle curve
	Effect of ultrasonic vibration on the wetting behavior of molten tin on copper substrate 期刊论文 Journal of Materials Science: Materials in Electronics, 2021, 卷号: 32, 期号: 1, 页码: 1073-1079 作者: Sun, Xuemin; Yu, Weiyuan; Wang, Fengfeng; Wang, Yanhong 收藏 \| 浏览/下载：13/0 \| 提交时间：2021/03/02 Copper Tin Ultrasonic effects Ultrasonic testing Ultrasonic waves Wetting Acoustic cavitations Additional forces Copper substrates Cross-section morphology Interfacial atoms Ultrasonic sound Ultrasonic vibration Wetting balance methods
	Promoting the electrocatalytic activity of platinum film for hydrogen evolution reaction by phosphorus doping 期刊论文 MATERIALS CHEMISTRY AND PHYSICS, 2021, 卷号: 263 作者: Zhao, Qiuping; Qian, Qingyi; Zhang, Bin; Zhang, Xingkai 收藏 \| 浏览/下载：4/0 \| 提交时间：2021/04/12 Platinum-phosphorus film Platinum film Electroless deposition Water splitting Hydrogen evolution reaction
	Design of suppressing optical and recombination losses in ultrathin CuInGaSe2 solar cells by Voronoi nanocavity arrays 会议论文作者: Wang, Yi-Chung; Chen, Chia-Wei; Su, Teng-Yu; Yang, Tzu-Yi; Liu, Wen-Wu 收藏 \| 浏览/下载：11/0 \| 提交时间：2020/12/18 Alumina Aluminum oxide Copper alloys Cost effectiveness Efficiency Electrodes Entertainment industry Film thickness Finite difference time domain method Gallium alloys Indium alloys Passivation Semiconductor alloys Thin films Time domain analysisCIGS solar cells Electrical performance High-efficiency Mass production Passivation layer Recombination loss Structural modeling Surface recombinations
	Design of suppressing optical and recombination losses in ultrathin CuInGaSe2 solar cells by Voronoi nanocavity arrays 期刊论文 Nano Energy, 2020, 卷号: 78 作者: Wang, Yi-Chung; Chen, Chia-Wei; Su, Teng-Yu; Yang, Tzu-Yi; Liu, Wen-Wu 收藏 \| 浏览/下载：6/0 \| 提交时间：2022/02/17 Alumina Aluminum oxide Copper alloys Cost effectiveness Efficiency Electrodes Entertainment industry Film thickness Finite difference time domain method Gallium alloys Indium alloys Passivation Semiconductor alloys Thin films Time domain analysis CIGS solar cells Electrical performance High-efficiency Mass production Passivation layer Recombination loss Structural modeling Surface recombinations
	Design of suppressing optical and recombination losses in ultrathin CuInGaSe2 solar cells by Voronoi nanocavity arrays 期刊论文 Nano Energy, 2020, 卷号: 78 作者: Wang, Yi-Chung; Chen, Chia-Wei; Su, Teng-Yu; Yang, Tzu-Yi; Liu, Wen-Wu 收藏 \| 浏览/下载：5/0 \| 提交时间：2020/11/14 Alumina Aluminum oxide Copper alloys Cost effectiveness Efficiency Electrodes Entertainment industry Film thickness Finite difference time domain method Gallium alloys Indium alloys Passivation Semiconductor alloys Thin films Time domain analysis CIGS solar cells Electrical performance High-efficiency Mass production Passivation layer Recombination loss Structural modeling Surface recombinations

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