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浏览/检索结果: 共6条，第1-6条 帮助 限定条件 专题：北京大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Wettability and spreadability study of molten Sn-3.0Ag-0.5Cu wetting on V-shaped substrate 期刊论文 SOLDERING & SURFACE MOUNT TECHNOLOGY, 2016 Xu, Bingsheng; Wu, Yan; Zhang, Lina; Chen, Junwei; Yuan, Zhangfu 收藏  |  浏览/下载：3/0  |  提交时间：2017/12/04 Surface morphology  Wettability  SAC  Lead-free solder  Surface evolver  V-shaped substrate  DYNAMIC CONTACT-ANGLE  LEAD-FREE SOLDERS  TEMPERATURE-COEFFICIENT  SURFACE-TENSION  NANOSTRUCTURED SURFACES  SIMULATION ANALYSIS  SN-AG  HYSTERESIS  DROPLETS  CU   Interfacial reaction thermodynamics between Sn-Cu-Ag solder and Ni substrate 会议论文 Xu, Hong Yan; Wu, Hu; Xu, Bing Sheng; Wu, Yan 收藏  |  浏览/下载：2/0  |  提交时间：2015/11/13 Dissolutive wetting process and interfacial characteristic of molten Sn-17Bi-0.5Cu alloy on copper substrate 期刊论文 稀有金属, 2013 Xu, Bing-Sheng; Zang, Li-Kun; Yuan, Zhang-Fu; Wu, Yan; Zhou, Zhou 收藏  |  浏览/下载：3/0  |  提交时间：2015/11/10 Lead-free solder  Reactive wetting  Sessile drop method  Interfaces  SOLDER JOINTS  CU SUBSTRATE  TEMPERATURE-COEFFICIENT  SURFACE-TENSION  SN-BI  WETTABILITY  KINETICS  SILICON  GROWTH  IMC   Reactive Wetting Processes and Triple-Line Configuration of Sn-3.5Ag on Cu Substrates at Elevated Temperatures 期刊论文 journal of electronic materials, 2012 Zang, Likun; Yuan, Zhangfu; Cao, Zhanmin; Matsuura, Hiroyuki; Tsukihashi, Fumitaka 收藏  |  浏览/下载：3/0  |  提交时间：2015/11/12 Wetting  metals and alloys  melting  interface  electronic materials  LEAD-FREE SOLDERS  BI-SN SYSTEM  SURFACE-TENSION  ALLOYS  AG  EQUILIBRIUM  BEHAVIOR   Wetting process and interfacial characteristic of Sn-3.0Ag-0.5Cu on different substrates at temperatures ranging from 503 K to 673 K 期刊论文 应用表面科学, 2011 Zang, Likun; Yuan, Zhangfu; Xu, Hongyan; Xu, Bingsheng 收藏  |  浏览/下载：5/0  |  提交时间：2015/11/12 Pb-free solder  Sessile drop method  Contact angle  Electronic materials  LEAD-FREE SOLDERS  BI-SN SYSTEM  SURFACE-TENSION  CU  WETTABILITY  BEHAVIOR  ALLOYS  AG   Phase diagram of Sn-In-Zn system and its use for lead-free solder 期刊论文 物理化学学报, 1998 Zheng, YJ; Zhang, QY 收藏  |  浏览/下载：3/0  |  提交时间：2015/11/16 Sn-In-Zn  ternary phase diagram  lead-free solder