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	Interfacial reaction thermodynamics between Sn-Cu-Ag solder and Ni substrate
	Xu, Hong Yan ; Wu, Hu ; Xu, Bing Sheng ; Wu, Yan
	2013
DOI	10.4028/www.scientific.net/AMM.433-435.2020
英文摘要	Interfacial reaction during wetting and spreading of Sn-Ag-Cu solder on Ni substrate is a key factor in order to improve the mechanical properties of the joints and the weld quality. Therefore, it's important to focus on the thermodynamic and kinetic analysis of this interface reaction. In this paper, the sessile drop method was used to study the spreading contour evolution. The Kissinger method was used to calculate thermo-kinetic parameters of reactions between Sn-Ag-Cu solder and Ni substrate based on DTA data. The results show that Cu reduces activation energy and reaction rate of Sn-Ag-Cu/Ni system. (Cu, Ni)6Sn5 phase mainly constitute the interface reaction layer of Sn-Ag-Cu/Ni. As the temperature increases, partial (Cu, Ni)6Sn5 phase is substituted by Ni3Sn4 phase. ? (2013) Trans Tech Publications, Switzerland.; EI; 0
语种	英语
内容类型	会议论文
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/316755]
专题	工学院
推荐引用方式 GB/T 7714	Xu, Hong Yan,Wu, Hu,Xu, Bing Sheng,et al. Interfacial reaction thermodynamics between Sn-Cu-Ag solder and Ni substrate[C]. 见:.

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