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CORC

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Fabrication and Characterization of Fine Pitch TSV Integration with Self-aligned Backside Insulation Layer Opening 其他
2016-01-01
Guan, Yong; Zeng, Qinghua; Chen, Jing; Ma, Shenglin; Jin, Yufeng
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03
Fabrication and Filling Quality Optimization of the High Density and Small Size Through Silicon Via Array for Three-dimensional Packaging 其他
2016-01-01
Guan, Yong; Zeng, Qinghua; Chen, Jing; Ma, Shenglin; Meng, Wei; Jin, Yufeng
收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03
Parametric Study of DRIE Process for Enhancing the Profile-preserving Property of Square Through Silicon Via 其他
2016-01-01
Guan, Yong; Zeng, Qinghua; Chen, Jing; Ma, Shenglin; Meng, Wei; Jin, Yufeng
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03
Stabilization and Utilization of Coupling MOS Capacitance between TSVs 其他
2016-01-01
Fang, Runiu; Liu, Huan; Miao, Min; Sun, Xin; Jin, Yufeng
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
Bias-dependent High Frequency Characterization of Through-Silicon Via (TSV) for 3D Integration 其他
2016-01-01
Sun, Xin; Fang, Runiu; Liu, Huan; Miao, Min; Jin, Yufeng
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
Interposer Fabrication with Annular Copper TSV and Multi-layered Redistribution Layer 其他
2016-01-01
Guan, Yong; Ma, Shenglin; Zeng, Qinghua; Meng, Wei; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03
An Accurate Calculation Method on Thermal Effectiveness of TSV and Wire 其他
2016-01-01
Pi, Yudan; Wang, Wei; Jin, Yufeng
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
Improvement of DRIE simulation method for process development application 其他
2015-01-01
Du, Hong; Yu, Min; Qi, Lin; Zhu, Zhiyuan; Wang, Hao; Zhang, Haixia; Jin, Yufeng; Shi, Baohua; Zhang, Zhao
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03
Improvement of DRIE simulation method for process development application 其他
2015-01-01
Du, Hong; Yu, Min; Qi, Lin; Zhu, Zhiyuan; Wang, Hao; Zhang, Haixia; Jin, Yufeng; Shi, Baohua; Zhang, Zhao
收藏  |  浏览/下载：4/0  |  提交时间：2017/12/03
Quality evaluation and simulation of through-multilayer TSV integration process for memory stacking 其他
2015-01-01
Guan, Yong; Zeng, Qinghua; Chen, Jing; Jin, Yufeng; Ma, Shenglin
收藏  |  浏览/下载：8/0  |  提交时间：2017/12/03

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