QQ客服 官方微博 反馈留言

	Improvement of DRIE simulation method for process development application
	Du, Hong ; Yu, Min ; Qi, Lin ; Zhu, Zhiyuan ; Wang, Hao ; Zhang, Haixia ; Jin, Yufeng ; Shi, Baohua ; Zhang, Zhao
	2015
关键词	DRIE simulation coil power model optimization simulator application
英文摘要	TSV (Through silicon via) is the new generation of packaging technology in integrated circuits industry. DRIE (deep reactive ion etching) process is the critical technology for TSV manufacturing. The simulation on DRIE has been researched a lot for process development. However it is still difficult to involve the equipment parameters directly in the simulation which is an obstacle to the application of simulation. In this paper, we try to develop a practical simulation method to involve the critical parameters of DRIE process such as coil power. The DRIE simulation is based on the two-dimensional topography evolution method that we have developed. The alternation etching of polymer and silicon in the Bosch process is modeled. Physical models for etching and deposition are included. A string-cell hybrid method based on string structure and cell structure is used. In order to connect the DRIE equipment parameters with the model parameters, the isotropic and ion etching rate of both silicon and polymer are considered respectively. The effects of coil power are described analytically and empirically. The extraction of the parameters of the function is performed by fitting the functions to experimental data. The functions are incorporated into the DRIE simulator. The functions can realize robust numerical simulation. The application of the simulator for the DRIE process development is demonstrated. The simulation results are verified by the experimental results.; CPCI-S(ISTP); yum@pku.edu.cn
语种	英语
出处	16 int conf elect packaging technology
内容类型	其他
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/450321]
专题	信息科学技术学院
推荐引用方式 GB/T 7714	Du, Hong,Yu, Min,Qi, Lin,et al. Improvement of DRIE simulation method for process development application. 2015-01-01.

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。