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浏览/检索结果: 共25条，第1-10条 帮助 限定条件 内容类型：会议     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 COMPRESSIVE SENSING METHOD FOR PRODUCTION CHIP TEST (CPCI-S收录) 会议 作者:  Zhan, Bolun[1];  Zhang, Yifan[1];  Li, Binbin[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/11 Interfacial reactions and formation of inter metallic compound of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu joints in flip-chip on BGA packaging (CPCI-S收录) 会议 作者:  Huang, Jia-Qiang[1];  Zhou, Min-Bo[1];  Li, Wang-Yun[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 lead-free solder joint  interfacial reaction  microstructure  BGA  differential scanning calorimetry   A research on the reliability of light-emitting diode based on analyzing of chip image (CPCI-S收录) 会议 作者:  Ruan, Jian[1];  Qian, Ke-Yuan[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 Tuning electronic properties of bilayer boron-phosphide by stacking order and electric field: A first principles investigation (EI收录) 会议 Wuhan, China, 作者:  Tan, Chunjian[1];  Zhou, Qiang[1];  Chen, Xianping[1] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/11 Chip scale packages  Electric fields  Electronic properties  Electronic structure  Electronics packaging  Monolayers   Research on thermal-electric coupling effect of the Copper Pillar Bump in the Flip Chip Packaging (CPCI-S收录) 会议 作者:  Fu Zhiwei[1,2];  Zhou Bin[1,2];  Yao Ruohe[1];  Li Xunping[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 Copper pillar bumps  thermal-electric coupling  Joule heat effcet  current density   Research on thermal-electric coupling effect of the copper pillar bump in the flip chip packaging (EI收录) 会议 Wuhan, China, 作者:  Fu, Zhiwei[1,2];  Zhou, Bin[1,2];  Yao, Ruohe[1];  Li, Xunping[2] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/11 Copper  Current density  Electronics packaging  Joule heating  Packaging  Stress concentration  Temperature distribution   Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (EI收录) 会议 Wuhan, China, 作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Li, Wang-Yun[1,2];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 Ball grid arrays  Electronics packaging  Flip chip devices  Isotherms  Lead  free solders  Microstructural evolution  Microstructure  Size determination  Soldered joints  Soldering  Soldering alloys  Surface chemistry   Design of Multifunctional Intelligent Car Based on Bluetooth Remote Control (CPCI-S收录) 会议 作者:  Nie, Ru[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/11 Single chip microcomputer  Bluetooth remote control  PWM speed control  photoelectric sensor   Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (CPCI-S收录) 会议 作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Li, Wang-Yun[1,2];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：10/0  |  提交时间：2019/04/11 BGA solder joint  size effect  lead-free solder  interfacial reaction  microstructure   Fabrication Process of a TSV Interposer for Radio Frequency Chip with Integrated Passive Devices (CPCI-S收录) 会议 作者:  Meng, Wei[1];  Jin, Yufeng[1];  Guan, Yong[2];  Zeng, Qinghua[2];  Hen, Jing C.[2] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/11 TSV Interposer  Lift-off Process  Interated Passive Devices  Radio Frequency System