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浏览/检索结果: 共7条，第1-7条 帮助 限定条件 内容类型：会议论文     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Assessment of lead-free inert gas soldering using a novel reflow technology 会议论文 ESTC 2006 - 1st Electronics Systemintegration Technology Conference, 2006-09-05 作者:  Ayoade, Oyebode[1];  Cristina, Andersson[2];  Tobias, Hjertkvist[3];  Johan, Liu[4] 收藏  |  浏览/下载：3/0  |  提交时间：2019/05/10 Assessment of lead-free inert gas soldering using a novel reflow technology 会议论文 1st Electronics Systemintegration Technology Conference 作者:  Ayoade, Oyebode[1];  Cristina, Andersson[2];  Tobias, Hjertkvist[3];  Johan, Liu[4] 收藏  |  浏览/下载：2/0  |  提交时间：2019/05/10 Assessment of lead-free inert gas soldering using a novel reflow technology 会议论文 ESTC 2006: 1ST ELECTRONICS SYSTEMINTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2006-01-01 作者:  Ayoade, Oyebode[1];  Cristina, Andersson[2];  Tobias, Hjertkvist[3];  Johan, Liu[4] 收藏  |  浏览/下载：2/0  |  提交时间：2019/05/10 Intermetallic compound formation in Sn-Co-Cu, Sn-Ag-Cu and eutectic Sn-Cu solder joints on electroless Ni(P) immersion Au surface finish after reflow soldering 会议论文 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '06), Proceedings, 2006-06-27 作者:  Sun, Peng[1];  Andersson, Cristina[2];  Wei, Xicheng[3];  Cheng, Zhaonian[4];  Shangguan, Dongkai[5] 收藏  |  浏览/下载：3/0  |  提交时间：2019/05/10 Phase Field Simulation of Solidification Behavior and Microstructure Evolution of Sn-58Bi/Cu Solder Interconnect During Reflow Soldering Proc (CPCI-S收录) 会议论文 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) 作者:  Ma, Wen-Jing[1];  Ke, Chang-Bo[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 Sn-58Bi/Cu interconnect  Solidification  Undercooling  Dendrite morphology  Phase field simulation   Phase field simulation of solidification behavior and microstructure evolution of Sn-58Bi/Cu solder interconnect during reflow soldering proc (EI收录) 会议论文 Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, China, August 11, 2013 - August 14, 2013 作者:  Ma, Wen-Jing[1];  Ke, Chang-Bo[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 Anisotropy  Electronics packaging  Flip chip devices  Microstructure  Morphology  Soldering  Soldering alloys  Solidification  Undercooling   Study on the optimization and analysis of the Mixed Reflow soldering with lead and lead-free solder in the high density assembly (EI收录) 会议论文 ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, August 13, 2012 - August 16, 2012 作者:  Huang, Yinglei[1];  Wu, Zhaohua[1];  Liu, Zhengwei[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15 Belt conveyors  Electric switches  Electronics packaging  Lead  Optimization  Preheating  Soldering  Soldering alloys  Welding