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	Assessment of lead-free inert gas soldering using a novel reflow technology
	Ayoade, Oyebode[1]; Cristina, Andersson[2]; Tobias, Hjertkvist[3]; Johan, Liu[4]
	2007
会议名称	ESTC 2006 - 1st Electronics Systemintegration Technology Conference
会议日期	2006-09-05
页码	428-437
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2384774
专题	上海大学
作者单位	[1]Sino-Swedish Microsystem Integration Technology Center, Department of Microtechnology and Nanoscience, Chalmers University of Technology, Kemiv?gen 9, Se-412 96, Gothenburg, Sweden [2]Sino-Swedish Microsystem Integration Technology Center, Department of Microtechnology and Nanoscience, Chalmers University of Technology, Kemiv?gen 9, Se-412 96, Gothenburg, Sweden [3]FOAB Elektronik AB, Sankt J?rgens v?g 8, 422 49 Hisings Backa, Sweden [4]Sino-Swedish Microsystem Integration Technology Center, Department of Microtechnology and Nanoscience, Chalmers University of Technology, Kemiv?gen 9, Se-412 96, Gothenburg, Sweden |Key State Laboratory for New Displays and System Application, SMIT Centre, Shanghai University, Yan Chang Road, No 149, Shanghai 200072, China
推荐引用方式 GB/T 7714	Ayoade, Oyebode[1],Cristina, Andersson[2],Tobias, Hjertkvist[3],et al. Assessment of lead-free inert gas soldering using a novel reflow technology[C]. 见:ESTC 2006 - 1st Electronics Systemintegration Technology Conference. 2006-09-05.

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