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浏览/检索结果: 共8条，第1-8条 帮助 限定条件 内容类型：会议论文    专题：华南理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Research progress on electrochemical deposition in electronic packaging (EI收录) 会议论文 Proceedings of the Electronic Packaging Technology Conference, EPTC, Shanghai, China, August 14, 2007 - August 17, 2007 作者:  Zhu, Dongsheng[1];  Lei, Junxi[1];  Wang, Changhong[1];  Hu, Hanying[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/17 Electrochemistry  Electroless plating  Electronics packaging  Electroplating  Industrial research  Metallizing  Plating  Printed circuit boards  Printed circuit manufacture  Printed circuits  Reduction  Research  Technology   A compact tunable notched-band ultra-wide-band antenna using a varactor diode (EI收录) 会议论文 Proceedings of 3rd Asia-Pacific Conference on Antennas and Propagation, APCAP 2014, Harbin, China, July 26, 2014 - July 29, 2014 作者:  Wong, Sai Wai[1];  Guo, Zai-Cheng[1];  Wang, Kai[1];  Chu, Qing-Xin[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/12 Antennas  Antennas  Broadband networks  Broadband networks  Diodes  Diodes  Microwave antennas  Microwave antennas  Printed circuit boards  Printed circuit boards  Printed circuits  Printed circuits  Varactors  Varactors   Modelling the operation optimization of multi-head surface mounting machines with over-head gantry in printed circuit board assembly (EI收录) 会议论文 Proceedings of the 33rd Chinese Control Conference, CCC 2014, Nanjing, China, July 28, 2014 - July 30, 2014 作者:  Luo, Jiaxiang[1,2];  Zhang, Xue[1,2];  Liu, Haiming[1,2] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/12 Integer programming  Machine components  Mathematical models  Mountings  Nozzles  Optimization  Printed circuit manufacture  Printed circuits  Surface mount technology   Saliency map based defect alarm system for FPC roll-to-roll process (EI收录) 会议论文 Advanced Materials Research, Dubai, United arab emirates, August 3, 2013 - August 4, 2013 作者:  Chen, An[1];  Hu, Yue Ming[1];  Wu, Xin Sheng[1];  Gao, Hong Xia[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 Alarm systems  Algorithms  Manufacture  Printed circuits   Effects of surface finishes on the intermetallic growth and micro-structure evolution of the Sn3.5Ag0.7Cu lead-free solder joints (EI收录) 会议论文 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009, Beijing, China, August 10, 2009 - August 13, 2009 作者:  Guoyuan, Li[1];  Chuan, Tang[2];  Xueyou, Yan[1];  Xinpeng, Xie[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/17 Activation energy  Electronics packaging  Growth kinetics  Growth rate  Lead  Morphology  Packaging  Polychlorinated biphenyls  Printed circuits  Semiconducting intermetallics  Silver  Silver alloys  Soldered joints  Soldering alloys   A novel fractal PCB power plane for power integrity in high speed mixed signal system (EI收录) 会议论文 APMC 2009 - Asia Pacific Microwave Conference 2009, Singapore, Singapore, December 7, 2009 - December 10, 2009 作者:  Huang, HuiFen[1];  Chu, QingXin[1];  Xie, ZeMing[1];  Xiao, JianKang[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/17 Electric signal systems  Microwaves  Printed circuits  Quality assurance  Sanitary sewers   Study of thermal fatigue lifetime of Fan-in Package on Package (FiPoP) by finite element analysis (EI收录) 会议论文 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009, Beijing, China, August 10, 2009 - August 13, 2009 作者:  Xueyou, Yan[1];  Guoyuan, Li[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/17 Electronics packaging  Finite element method  Lead  Packaging  Printed circuits  Silver  Soldered joints  Soldering  Soldering alloys  Thermal cycling  Thermal fatigue   Optimization algorithm for low-volume and high-mix PCB assembly (EI收录) 会议论文 5th International Conference on Natural Computation, ICNC 2009, Tianjian, China, August 14, 2009 - August 16, 2009 作者:  Haiming, Liu[1];  Peng, Yuan[1];  Jiaxiang, Luo[1];  Mei, Zhang[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/17 Algorithms  Assembly  Polychlorinated biphenyls  Printed circuit manufacture  Printed circuits