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CORC

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Effects of electromigration on microstructural evolution and mechanical properties of preferential growth intermetallic compound interconnects for 3D packaging 会议论文
69th IEEE Electronic Components and Technology Conference, ECTC 2019, Las Vegas, NV, United states, 2019-05-28
作者:  Huang, Mingliang L.;  Zou, Lin
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/02
Preliminary studies on the effects of laser irradiations on nerve injuries caused by high frequency electrical stimulations 会议论文
9th International Congress on Image and Signal Processing, BioMedical Engineering and Informatics, CISP-BMEI 2016
作者:  Sun L.;  Li S.;  Sheng S.;  Chen L.;  Liu H.
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/03
In situ study the effects of Cu addition on the rapidly growth of Cu6Sn5 at the Sn-base solder/Cu L-S interface during soldering heat preservation stage 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Guo, Bingfeng;  Jiang, Chengrong;  Kunwar, Anil;  Chen, Jun;  Zhao, Ning
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03
Effects of Cu Nanoparticles Doped Flux on the Microstructure of IMCs between Sn Solder and Cu Substrate 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Shang, Shengyan;  Kunwar, Anil;  Wu, Yingchao;  Ma, Haitao
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/03
Effects of Current Stress for Low Temperature Cu/Sn/Cu Solid-State-Diffusion Bonding 会议论文
2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017), 2017-01-01
作者:  Cai, Jian;  Wang, Qian;  Wang, Dejun;  Wang, Junqiang;  Wu, Zijian
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/09
Effects of Bath Temperature on Co-electroplating Au-Sn Alloys for Electronic Packaging 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16
作者:  Tang, Fangwu;  Huang, Mingliang;  Huang, Feifei
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/09
Effects of shape of closed space on agent motion 会议论文
3rd International Conference on Advanced Engineering Materials and Architecture Science, ICAEMAS 2014, 2014-07-26
作者:  Liu Z.Z.;  Wang X.Y.;  Wang M.G.
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/11
Effects of Temperature and Current Density on (Au, Pd, Ni)Sn-4 Redistribution and Ni-P Consumption in Ni/Sn3.0Ag0.5Cu/ENEPIG Flip Chip Solder Joints 会议论文
14th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Dalian, PEOPLES R CHINA, 2013-01-01
作者:  Chen, Leida;  Feng, Yi;  Liu, Xiaoyan;  Huang, Mingliang
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/11
Effects of temperature and current density on (Au, Pd, Ni)Sn4 redistribution and Ni-P consumption in Ni/Sn3.0Ag0.5Cu/ENEPIG flip chip solder joints 会议论文
2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, 2013-08-11
作者:  Chen L.;  Feng Y.;  Liu X.;  Huang M.
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/13
Effects of Cooling Rate and Solder Volume on the Formation of Large Ag3Sn Plates in Sn-Ag Based Solder Joints 会议论文
13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, PEOPLES R CHINA, 2012-01-01
作者:  Zhou, Qiang;  Huang, Mingliang;  Zhao, Ning;  Zhang, Zhijie
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/13

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