| Effects of Current Stress for Low Temperature Cu/Sn/Cu Solid-State-Diffusion Bonding | |
| Cai, Jian; Wang, Qian; Wang, Dejun; Wang, Junqiang; Wu, Zijian | |
| 2017 | |
| 会议名称 | 2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017) |
| 会议日期 | 2017-01-01 |
| 关键词 | 3D integration solid-state-diffusion (SSD) bonding surface pretreatment electromigration (EM) |
| 页码 | 1742-1747 |
| 会议录 | 2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017)
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| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/4353619 |
| 专题 | 大连理工大学 |
| 作者单位 | 1.Tsinghua Univ, Inst Microelect, Beijing, Peoples R China. 2.Tsinghua Natl Lab Informat Sci & Technol, Beijing, Peoples R China. 3.Tsinghua Univ, Inst Microelect, Beijing, Peoples R China. 4.Dalian Univ Technol, Sch Elect Sci & Technol, Dalian, Peoples R China. 5.Tsinghua Univ, Inst Microelect, Beijing, Peoples R China. 6.Dalian Univ Technol, Sch Elect Sci & Technol, Dalian, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Cai, Jian,Wang, Qian,Wang, Dejun,et al. Effects of Current Stress for Low Temperature Cu/Sn/Cu Solid-State-Diffusion Bonding[C]. 见:2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017). 2017-01-01. |
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