CORC

在结果中检索

CORC

浏览/检索结果: 共247条，第1-10条 帮助

限定条件    
已选(0)清除 条数/页：   排序方式：
Structure and properties of Sn-Cu lead-free solders in electronics packaging 期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 421-444
作者:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-Quan;  Xiong, Ming-Yue;  Sun, Lei
收藏  |  浏览/下载：130/0  |  提交时间：2021/02/02
The effects of substrate dilution on the microstructure and wear resistance of PTA Cu-Al-Fe aluminium bronze coatings 期刊论文
Wear, 2019, 卷号: 440-441
作者:  Kucita, P.;  Wang, S.C.;  Li, W.S.;  Cook, R.B.;  Starink, M.J.
收藏  |  浏览/下载：18/0  |  提交时间：2020/11/14
Quantitative investigation on sink strength of nano-grain boundary for irradiation resistance 期刊论文
JOURNAL OF NUCLEAR MATERIALS, 2019, 卷号: 526, 页码: 12
作者:  Mao, Pengyan;  Cui, Jingping;  Chen, Yangchun;  Qiu, Jianhang;  Jin, Qun
收藏  |  浏览/下载：51/0  |  提交时间：2021/02/02
Quantitative investigation on sink strength of nano-grain boundary for irradiation resistance 期刊论文
JOURNAL OF NUCLEAR MATERIALS, 2019, 卷号: 526, 页码: 12
作者:  Mao, Pengyan;  Cui, Jingping;  Chen, Yangchun;  Qiu, Jianhang;  Jin, Qun
收藏  |  浏览/下载：26/0  |  提交时间：2021/02/02
Effects of Sc and Zr microalloying on the microstructure and mechanical properties of high Cu content 7xxx Al alloy 期刊论文
INTERNATIONAL JOURNAL OF MINERALS METALLURGY AND MATERIALS, 2019, 卷号: 26, 期号: 12, 页码: 1559-1569
作者:  Liu, Chong-yu;  Teng, Guang-biao;  Ma, Zong-yi;  Wei, Li-li;  Zhang, Bing
收藏  |  浏览/下载：168/0  |  提交时间：2021/02/02
Effects of Sc and Zr microalloying on the microstructure and mechanical properties of high Cu content 7xxx Al alloy 期刊论文
INTERNATIONAL JOURNAL OF MINERALS METALLURGY AND MATERIALS, 2019, 卷号: 26, 期号: 12, 页码: 1559-1569
作者:  Liu, Chong-yu;  Teng, Guang-biao;  Ma, Zong-yi;  Wei, Li-li;  Zhang, Bing
收藏  |  浏览/下载：145/0  |  提交时间：2021/02/02
Quantitative investigation on sink strength of nano-grain boundary for irradiation resistance 期刊论文
JOURNAL OF NUCLEAR MATERIALS, 2019, 卷号: 526, 页码: 12
作者:  Mao, Pengyan;  Cui, Jingping;  Chen, Yangchun;  Qiu, Jianhang;  Jin, Qun
收藏  |  浏览/下载：18/0  |  提交时间：2022/01/19
Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints 期刊论文
Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 24, 页码: 21126-21137
作者:  Yi, Xiong;  Yi, Guangbin;  Hu, Xiaowu;  Li, Qinglin;  Zhang, Ruhua
收藏  |  浏览/下载：1/0  |  提交时间：2020/11/14
Effect of nano-CeO2 addition on the consolidation of W-5Ni-3Cu alloy by a two-step sintering process 期刊论文
RESULTS IN PHYSICS, 2019, 卷号: 15
作者:  Dong, Hongfeng;  Gong, Jun;  Li, Wensheng
收藏  |  浏览/下载：18/0  |  提交时间：2022/03/01
Elaborating highly thermal-conductive diamond/Cu composites by sintering intermittently electroplated core-shell powders 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2019, 卷号: 810, 页码: 7
作者:  Sun, Hong;  Guo, Lijiang;  Deng, Nan;  Li, Xiaoyu;  Li, Jiangtao
收藏  |  浏览/下载：90/0  |  提交时间：2019/11/12

©版权所有 ©2017 CSpace - Powered by CSpace