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CORC

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Three-dimensions thermal model of a high-power diode laser bar 期刊论文
APPLIED OPTICS, 2018, 卷号: 57, 期号: 33, 页码: 9868-9876
作者:  Wu, Di-Hai;  Zah, Chung-En;  Liu, Xingsheng
收藏  |  浏览/下载：22/0  |  提交时间：2018/12/10
Calibration of a Constitutive Model from Tension and Nanoindentation for Lead-Free Solder 期刊论文
MICROMACHINES, 2018, 卷号: 9, 期号: 11, 页码: Ar-608
作者:  Long X;  Zhang XD;  Tang WB;  Wang SB;  Feng YH(冯义辉)
收藏  |  浏览/下载：35/0  |  提交时间：2018/12/12
Fabrication of Ni-P coating film on diamond/Al composite and its soldering reliability 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 10, 页码: 8371-8379
作者:  Shi, QY;  Liu, ZQ;  Wu, D;  Zhang, H;  Ni, DR
收藏  |  浏览/下载：30/0  |  提交时间：2018/06/05
The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 739, 页码: 632-642
作者:  Gao, LY;  Li, CF;  Wan, P;  Zhang, H;  Liu, ZQ
收藏  |  浏览/下载：24/0  |  提交时间：2018/06/05
High Frequency Induction Brazing Process of Copper-Steel and Its Effects on Microstructure and Electrical Conductivity of Weld Joint 期刊论文
Cailiao Daobao/Materials Review, 2018, 卷号: 32, 期号: 3, 页码: 909-914
作者:  Shi, Yu;  Gao, Haiming;  Li, Guang;  Li, Xiang
收藏  |  浏览/下载：0/0  |  提交时间：2020/11/14
Effect of Ag element on microstructure and mechanical properties of Sn-Bi-xAg solders designed by cluster-plus-glue-atom model 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Ren, Jing;  Huang, Mingliang;  Yang, Xudong
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/02
Mechanism of Cu5Zn8 layer act as a diffusion barrier layer 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Yao, Jinye;  Li, Hua;  Huang, Ru;  Qi, Xiao;  Wang, Boyin
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/02
Effect of In addition on the properties of Sn-Au-Cu lead-free solder 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Yin, Siqi;  Huang, Mingliang;  Chen, Yu
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/02
Influence of RE and Ni on Microstructure and Properties of Zn20Sn High -temperature Lead-Free Solder 期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2018, 卷号: 47, 页码: 1860-1865
作者:  Li Xiaojun;  Tian Jun;  Dai Pinqiang;  Wang Haiyan
收藏  |  浏览/下载：4/0  |  提交时间：2019/11/21
Effect of rapid inducted heating on the microstructure of solder joint in IC 会议论文
19th International Conference on Electronic Packaging Technology (ICEPT), Inst Microelectron Chinese Acad Sci, Shanghai, PEOPLES R CHINA, AUG 08-11, 2018
作者:  Chen, Jibing*;  Wan, Nong;  Li, Juying;  He, Zhanwen;  Wu, Yiping
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/27

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