| Effect of rapid inducted heating on the microstructure of solder joint in IC | |
| Chen, Jibing*; Wan, Nong; Li, Juying; He, Zhanwen; Wu, Yiping | |
| 2018 | |
| 会议名称 | 19th International Conference on Electronic Packaging Technology (ICEPT) |
| 会议日期 | AUG 08-11, 2018 |
| 会议地点 | Inst Microelectron Chinese Acad Sci, Shanghai, PEOPLES R CHINA |
| 关键词 | lead-free joint rapid thermal cycling microstructure IMC electronic packaging |
| 页码 | 815-818 |
| 会议录 | 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)
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| URL标识 | 查看原文 |
| WOS记录号 | WOS:000450155700177 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/5583983 |
| 专题 | 武汉轻工大学 |
| 作者单位 | 1.[Wan, Nong 2.He, Zhanwen 3.Chen, Jibing 4.Li, Juying] Wuhan Polytech Univ, Sch Mech Engn, Wuhan, Hubei, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Chen, Jibing*,Wan, Nong,Li, Juying,et al. Effect of rapid inducted heating on the microstructure of solder joint in IC[C]. 见:19th International Conference on Electronic Packaging Technology (ICEPT). Inst Microelectron Chinese Acad Sci, Shanghai, PEOPLES R CHINA. AUG 08-11, 2018. |
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