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浏览/检索结果: 共4条，第1-4条 帮助 限定条件 发表日期：2018     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Process development and reliability for wafer-level 3D IC integration using micro-bump/adhesive hybrid bonding and via-last TSVs 会议论文 19th International Conference on Electronic Packaging Technology, ICEPT 2018, Shanghai, China, 2018-08-08 作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao 收藏  |  浏览/下载：14/0  |  提交时间：2019/12/02 Process development and reliability for wafer-level 3D IC integration using micro- bump/adhesive hybrid bonding and via-last TSVs 会议论文 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01 作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao 收藏  |  浏览/下载：10/0  |  提交时间：2019/12/02 3D IC  wafer-level hybrid bonding  insert Cu pillar solder bump  dry film adhesive  TSVs  reliability   Optimization and Characterization of Low-Temperature Wafer-Level Hybrid Bonding Using Photopatternable Dry Film Adhesive and Symmetric Micro Cu Pillar Solder Bumps 期刊论文 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 页码: 1855-1862 作者:  Yao, Mingjun;  Zhao, Ning;  Wang, Teng;  Yu, Daquan;  Xiao, Zhiyi 收藏  |  浏览/下载：13/0  |  提交时间：2019/12/02 3-D IC  bump  dry film adhesive  wafer-level hybrid bonding   Enhancing airtightness of TGV through regulating interface energy for wafer-level vacuum packaging 期刊论文 Microsystem Technologies, 2018, 卷号: Vol.24 No.9, 页码: 3645-3649 作者:  Yunbin Kuang;  Dingbang Xiao;  Jian Zhou;  Ming Zhuo;  Wenyin Li 收藏  |  浏览/下载：10/0  |  提交时间：2019/12/26