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A new multiaxial fatigue life prediction model for aircraft aluminum alloy 期刊论文
INTERNATIONAL JOURNAL OF FATIGUE, 2021, 卷号: 143, 页码: 16
作者:  Zhao, Bingfeng;  Xie, Liyang;  Wang, Lei;  Hu, Zhiyong;  Zhou, Song
收藏  |  浏览/下载：14/0  |  提交时间：2021/03/15
An improved dynamic load-strength interference model for the reliability analysis of aero-engine rotor blade system 期刊论文
PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART G-JOURNAL OF AEROSPACE ENGINEERING, 2020, 页码: 19
作者:  Zhao, Bingfeng;  Xie, Liyang;  Zhang, Yu;  Ren, Jungang;  Bai, Xin
收藏  |  浏览/下载：98/0  |  提交时间：2021/10/15
Has the public lost confidence in vaccines because of a vaccine scandal in China 期刊论文
VACCINE, 2019, 卷号: 37, 页码: 5270-5275
作者:  Han, Bingfeng;  Wang, Shuai;  Wan, Yongmei;  Liu, Jiang;  Zhao, Tianshuo
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/30
Adiabatic shear localization in the CrMnFeCoNi high-entropy alloy 期刊论文
Acta Materialia, 2018, 卷号: 151, 页码: 424-431
作者:  Li, Zezhou;  Zhao, Shiteng;  Alotaibi, Senhat M.;  Liu, Yong;  Wang, Bingfeng
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/03
Synchrotron radiation imaging study on the rapid IMC growth of Sn-xAg solders with Cu and Ni substrates during the heat preservation stage 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 页码: 589-601
作者:  Guo, Bingfeng;  Kunwar, Anil;  Jiang, Chengrong;  Zhao, Ning;  Sun, Junhao
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Roles of interfacial heat transfer and relative solder height on segregated growth behavior of intermetallic compounds in Sn/Cu joints during furnace cooling 期刊论文
INTERMETALLICS, 2018, 卷号: 93, 页码: 186-196
作者:  Kunwar, Anil;  Guo, Bingfeng;  Shang, Shengyan;  Raback, Peter;  Wang, Yunpeng
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Effect of Ag3Sn nanoparticles and temperature on Cu6Sn5 IMC growth in Sn-xAg/Cu solder joints 期刊论文
MATERIALS RESEARCH BULLETIN, 2018, 卷号: 99, 页码: 239-248
作者:  Guo, Bingfeng;  Kunwar, Anil;  Zhao, Ning;  Chen, Jun;  Wang, Yunpeng
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02
Pharmacokinetics and Preliminary Pharmacodynamics of Single- and Multiple-dose Lyophilized Recombinant Glucagon-like Peptide-1 Receptor Agonist (rE-4) in Chinese Patients with Type 2 Diabetes Mellitus 期刊论文
CLINICAL DRUG INVESTIGATION, 2017, 卷号: 37, 期号: 12
作者:  
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/05
Formation mechanism and kinetic analysis of the morphology of Cu6Sn5 in the spherical solder joints at the Sn/Cu liquid-solid interface during soldering cooling stage 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2017, 卷号: 28, 页码: 5398-5406
作者:  Guo, Bingfeng;  Ma, Haitao;  Jiang, Chengrong;  Wang, Yunpeng;  Kunwar, Anil
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/02
In situ study the effects of Cu addition on the rapidly growth of Cu6Sn5 at the Sn-base solder/Cu L-S interface during soldering heat preservation stage 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Guo, Bingfeng;  Jiang, Chengrong;  Kunwar, Anil;  Chen, Jun;  Zhao, Ning
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03

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