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浏览/检索结果: 共16条，第1-10条 帮助 限定条件 内容类型：会议     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Effect of heat treatment on morphology of Fe-rich intermetallics in Al-Cu alloys (CPCI-S收录) 会议 作者:  Lin, B.[1];  Zhang, W. W.[2] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/11 Al-Cu alloys  Iron-rich intermetallics  Solid-state phase transformation  Solution heat treatment   Evolution of copper species on Cu/SAPO-34 SCR catalysts upon hydrothermal aging (CPCI-S收录) 会议 作者:  Liu, Xuesong[1,2];  Wu, Xiaodong[1];  Weng, Duan[1,2];  Si, Zhichun[2];  Ran, Rui[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 SAPO-34  Surface CuO clusters  Isolated Cu2+  Hydrothermal ageing  Acid sites  SCR   Effect of the Au bonding pad contamination on the wettability of Au/Sn-3.0Ag-0.5Cu/Au solder joints in flux-free laser jet solder ball bondin (CPCI-S收录) 会议 作者:  Yue, Wu[1];  Zhou, Min-Bo[2,3];  Zhang, Xin-Ping[2,3] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 laser jet solder ball bonding  Sn-3.0Ag-0.5Cu solder ball  wettability  surface contamination   铁碳微电解协同芬顿氧化降解Cu-EDTA的研究 会议 厦门, 作者:  周东方;  胡勇有;  党亚攀;  陈元彩;  程建华 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/11 微电解  芬顿 Cu-EDTA  调控策略  氧化降解   Fabrication of a hybrid paste consisting of microscale Ag-plated Cu flakes and nanoscale Ag particles and characterization of low-temperature (CPCI-S收录) 会议 作者:  Jin, Hong;  Zhu, Jie-Fei;  Zhou, Min-Bo;  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/11 Ag-plated Cu flakes  plating process  hybrid paste  sintered joints   Influence of the zinc-oxide/salt content in the aluminum soldering flux on interfacial microstructure and mechanical property of Sn-0.7Cu/Al (CPCI-S收录) 会议 作者:  Chen, Guo-Liang[1,2];  Zhou, Min-Bo[1,2];  Zhang, Lang[1,2];  Lin, Yuan-Jiang[1,2];  Zhang, Yu-Peng[3] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/11 aluminum soldering  Sn-0.7Cu solder  interfacial microstructure  mechanical property  LED assembly   Design of Cu-Cu2O/g-C3N4 nanocomponent photocatalysts for hydrogen evolution under visible light irradiation using water-soluble Erythrosin B (CPCI-S收录) 会议 作者:  Zhang, Piyong[1];  Wang, Tingting[1];  Zeng, Heping[1] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/11 Cu-Cu2O/g-C3N4  Hydrogen evolution  Photocatalytic  Sensitization   Phase field simulation of the microstructural evolution and electromigration-induced phase segregation in line-type Cu/Sn-Bi/Cu solder interc (CPCI-S收录) 会议 作者:  Liang, Shui-Bao;  Ke, Chang-Bo;  Tan, Meng-Ying;  Zhou, Min-Bo;  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 electromigration  microstructure evolution  phase segregation  Cu/Sn-Bi/Cu interconnect  phase field simulation   The Paleozoic tectonic evolution and metallogenesis of the northern margin of East Junggar, Central Asia Orogenic Belt: Geochronological and (CPCI-S收录) 会议 作者:  Liang, Pei[1,2];  Chen, Huayong[1,5];  Hollings, Pete[3];  Xiao, Bing[1,2];  Wu, Chao[1,2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 Qiaoxiahala Fe-Cu deposit  Devonian-Carboniferous East Junggar  Central Asian Orogenic Belt  Tectonic evolution  Metallogenesis  Geochemistry   Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging (CPCI-S收录) 会议 作者:  Huang, Lia-Qiang[1,2];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/11 Sn58Bi  Sn3.0Ag0.5Cu  Mixed solder joint  Microstructure  interfacial reaction  Ball grid array