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| AGV POSITION AND ORIENTATION MEASUREMENT DEVICE USING TWO ENCODERS AND APPLICATION THEREOF 专利
申请日期: 2019-09-12, 公开日期: 2019-09-12
作者: Zhou J(周军); Sang D(桑迪); Huang PL(皇攀凌); Ren JY(任纪颖); Chen QW(陈庆伟)
  收藏 | 浏览/下载：12/0 | 提交时间：2020/01/04 |
| Broadband chaos laser storage pool parallel computation device, has light source component connected with two laser generate circuits by bandwidth enhancement chain, where bandwidth enhancement chain is provided with four light attenuators. 专利
申请日期: 2016-01-01, 公开日期: 2016-02-03
作者: HUANG D LIU F LI F YIN H ZHAO Q SHI
收藏 | 浏览/下载：4/0 | 提交时间：2019/12/09 |
| Electric liquid beam machining tool gap processing early warning device, has distance adjuster fixedly connected with supporting frame through screw thread hole, where distance between quartz nozzle and supporting frame is determined. 专利
申请日期: 2016-01-01, 公开日期: 2016-06-01
作者: HUANG S LIU X XU W YANG X CHEN F ZH
收藏 | 浏览/下载：6/0 | 提交时间：2019/12/09 |
| Processing super-hydrophobic surface having high adhesion micropattern by electro-hydraulic beam process used in non-destructive liquid storage, involves fixing metal substrate to be processed on electro-hydraulic beam processing apparatus. 专利
申请日期: 2016-01-01, 公开日期: 2016-05-25
作者: HUANG S LIU X SONG J YANG X CHEN F
收藏 | 浏览/下载：4/0 | 提交时间：2019/12/09 |
| Preparation of full metallic compound interconnecting welding point involves taking first substrate, plating, sputtering, annealing, sputtering, vapor depositing, evaporating, adding second substrate, plating, sputtering and welding. 专利
申请日期: 2015-01-01, 公开日期: 2015-06-10
作者: HUANG M YANG F ZHANG Z ZHAO N HUANG F
收藏 | 浏览/下载：2/0 | 提交时间：2019/12/09 |
| Three-dimensional vertical through-hole filling intermetallic compound package, has package body made of brazing filler metal, where brazing filler metal is selected from group consisting of tin filler metal and indium filler metal. 专利
申请日期: 2015-01-01, 公开日期: 2015-06-10
作者: HUANG M MA H YANG F ZHANG F ZHANG Z
收藏 | 浏览/下载：3/0 | 提交时间：2019/12/09 |
| Method for preparing inter-metallic compound thin film involves forming temperature gradient between the metal substrates, and performing metal solder generating reaction between the two substrates is performed to form thin film. 专利
申请日期: 2015-01-01, 公开日期: 2015-06-03
作者: HUANG M YANG F ZHANG Z ZHAO J ZHAO N
收藏 | 浏览/下载：3/0 | 提交时间：2019/12/09 |
| Preparation of intermetallic compound thin film involves providing first metal substrate, subjecting first metal substrate to plating, sputtering, vapor deposition, or brazing with filler metal layer, and providing second metal substrate. 专利
申请日期: 2015-01-01, 公开日期: 2015-05-27
作者: HUANG M MA H YANG F ZHANG Z ZHAO J
收藏 | 浏览/下载：4/0 | 提交时间：2019/12/09 |
| Microelectronic package soldered dot creep resistance compression test device, has peripheral device provided with computer, and optical displacement meter mechanism or LVDT displacement meter mechanism recording displacement of sample. 专利
申请日期: 2014-01-01, 公开日期: 2014-01-22
作者: HUANG M MA H ZHANG F ZHAO J ZHAO N
收藏 | 浏览/下载：5/0 | 提交时间：2019/12/11 |
| Tin-zinc-bismuth lead-free solder alloy for soldering aluminum-copper comprises zinc, bismuth, aluminum, nickel, and/or tin. 专利
申请日期: 2014-01-01, 公开日期: 2014-04-23
作者: HUANG M ZHANG F ZHAO N ZHANG T YANG Y
收藏 | 浏览/下载：3/0 | 提交时间：2019/12/11 |
