| Microelectronic package soldered dot creep resistance compression test device, has peripheral device provided with computer, and optical displacement meter mechanism or LVDT displacement meter mechanism recording displacement of sample. | |
| HUANG M MA H ZHANG F ZHAO J ZHAO N | |
| 2014 | |
| 公开日期 | 2014-01-22 |
| URL标识 | 查看原文 |
| 申请日期 | 2013-10-24 |
| 内容类型 | 专利 |
| URI标识 | http://www.corc.org.cn/handle/1471x/4515967 |
| 专题 | 大连理工大学 |
| 作者单位 | UNIV DALIAN TECHNOLOGY (UYDA-C |
| 推荐引用方式 GB/T 7714 | HUANG M MA H ZHANG F ZHAO J ZHAO N. Microelectronic package soldered dot creep resistance compression test device, has peripheral device provided with computer, and optical displacement meter mechanism or LVDT displacement meter mechanism recording displacement of sample.. 2014-01-01. |
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