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	Method for preparing inter-metallic compound thin film involves forming temperature gradient between the metal substrates, and performing metal solder generating reaction between the two substrates is performed to form thin film.
	HUANG M YANG F ZHANG Z ZHAO J ZHAO N
	2015
公开日期	2015-06-03
URL标识	查看原文
申请日期	2015-02-09
内容类型	专利
URI标识	http://www.corc.org.cn/handle/1471x/4413427
专题	大连理工大学
作者单位	UNIV DALIAN TECHNOLOGY (UYDA-C
推荐引用方式 GB/T 7714	HUANG M YANG F ZHANG Z ZHAO J ZHAO N. Method for preparing inter-metallic compound thin film involves forming temperature gradient between the metal substrates, and performing metal solder generating reaction between the two substrates is performed to form thin film.. 2015-01-01.

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