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CORC

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Low temperature multi-layer wafer level package for chip scale atomic clock (CSAC) 其他
2015-01-01
Li, Nannan; Zhang, Yangxi; Zhu, Ningli; Zhu, Yunhui; Gao, Chengchen; Chen, Jing
收藏  |  浏览/下载：7/0  |  提交时间：2017/12/03
Temporary Bonding/Debonding of Silicon Substrates Based on Propylene Carbonate 期刊论文
JOURNAL OF ELECTRONIC PACKAGING, 2015
Zhu, Zhiyuan; Yu, Min; Liu, Lisha; Jin, Yufeng
收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03
Low Temperature Multi-layer Wafer Level Package for Chip Scale Atomic Clock (CSAC) 其他
2015-01-01
Li, Nannan; Zhang, Yangxi; Zhu, Ningli; Zhu, Yunhui; Gao, Chengchen; Chen, Jing
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
A TSV Last Integration Approach with Wafer Level Pre-patterned Adhesive Bonding 其他
2012-01-01
Zhu, Yunhui; Ma, Shenglin; Sun, Xin; Cui, Qinghu; Zhong, Xiao; Bian, Yuan; Chen, Jing; Miao, Min; Jin, Yufeng
收藏  |  浏览/下载：2/0  |  提交时间：2015/11/16
Development of a Through-Stack-Via Integrated SRAM Module 其他
2012-01-01
Zhu, Yunhui; Sun, Xin; Ma, Shenglin; Cui, Qinghu; Zhong, Xiao; Bian, Yuan; Chen, Meng; Xiao, Yongqiang; Fang, Runiu; Liu, Zhenhua; Zhu, Zhiyuan; Gong, Xin; Chen, Jing; Miao, Min; Lu, Wengao; Jin, Yufeng
收藏  |  浏览/下载：5/0  |  提交时间：2015/11/16
Non-planar surface bonding with spray-coated SU-8 as adhesive layer 期刊论文
micro nano letters, 2012
Li, Nannan; He, Shuwei; Zhao, Qiancheng; Zhang, Shibin; Chen, Jing
收藏  |  浏览/下载：3/0  |  提交时间：2015/11/13
Study on Flow Behavior of BCB in Adhesive Bonding Aiming at Reducing Transverse Deformation 其他
2012-01-01
Deng, Kangfa; Zheng, Huan; Jiang, Shaobo; Zhang, Wei
收藏  |  浏览/下载：2/0  |  提交时间：2015/11/13
Single-Mask, Flip-Bonded Titanium-On-Glass (FBTOG) Technology for Wafer-Level Batch Fabrication of Suspended High-Aspect-Ratio Bulk Titanium Microstructures 其他
2009-01-01
Zhang, Y.; Zhao, G.; Shu, Q.; Tian, Y.; Li, W.; Chen, J.
收藏  |  浏览/下载：4/0  |  提交时间：2015/11/10
Single-Mask, Flip-Bonded Titanium-On-Glass (FBTOG) Technology for Wafer-Level Batch Fabrication of Suspended High-Aspect-Ratio Bulk Titanium Microstructures 期刊论文
Procedia Chemistry, 2009
Zhang, Y.; Zhao, G.; Shu, Q.; Tian, Y.; Li, W.; Chen, J.
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03
Wafer bonding with intermediate parylene layer 其他
2008-01-01
Shu, Qiong; Huang, Xianju; Wang, Ying; Chen, Jing
收藏  |  浏览/下载：5/0  |  提交时间：2015/11/10

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