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	Process and pad design optimization for 01005 passive component surface mount assembly
	Wang, Yu[1]; Olorunyomi, Michael[2]; Dahlberg, Martin[3]; Djurovic, Zoran[4]; Anderson, Johan[5]; Liu, Johan[6]
刊名	SOLDERING & SURFACE MOUNT TECHNOLOGY
	2007
卷号	19页码:34-44
关键词	electrical components size reduction printed circuits
ISSN号	0954-0911
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2387750
专题	上海大学
作者单位	1.Chalmers, SMIT Ctr, Dept Microtechnol & Nanosci, Gothenburg, Sweden. 2.MYDATA Automat AB, Gothenburg, Sweden. 3.Shanghai Univ, SMIT Ctr, State Lab New Displays & Syst Integrat, Shanghai, Peoples R China.
推荐引用方式 GB/T 7714	Wang, Yu[1],Olorunyomi, Michael[2],Dahlberg, Martin[3],et al. Process and pad design optimization for 01005 passive component surface mount assembly[J]. SOLDERING & SURFACE MOUNT TECHNOLOGY,2007,19:34-44.
APA	Wang, Yu[1],Olorunyomi, Michael[2],Dahlberg, Martin[3],Djurovic, Zoran[4],Anderson, Johan[5],&Liu, Johan[6].(2007).Process and pad design optimization for 01005 passive component surface mount assembly.SOLDERING & SURFACE MOUNT TECHNOLOGY,19,34-44.
MLA	Wang, Yu[1],et al."Process and pad design optimization for 01005 passive component surface mount assembly".SOLDERING & SURFACE MOUNT TECHNOLOGY 19(2007):34-44.

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