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CORC

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High-quality dissimilar friction stir welding of Al to steel with no contacting between tool and steel plate 期刊论文
MATERIALS CHARACTERIZATION, 2022, 卷号: 191, 页码: 7
作者:  Zhang, M.;  Wang, Y. D.;  Xue, P.;  Zhang, H.;  Ni, D. R.
收藏  |  浏览/下载：24/0  |  提交时间：2022/09/16
Study on the micro-interface behavior of 2024Al light alloy bonded by ultrasonic assisted solid phase diffusion welding with Ag interlayer under atmosphere 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2022, 卷号: 833, 页码: 10
作者:  Wang, Qian;  Nie, Yong;  Shao, Yingfeng;  Liu, Hongzhi;  Hu, Xiaoqiang
收藏  |  浏览/下载：11/0  |  提交时间：2022/07/01
The interfacial reaction and microstructure of Co/In/Cu sputtering target assembly after soldering 期刊论文
MICROELECTRONICS RELIABILITY, 2020, 卷号: 113, 页码: 6
作者:  Liu, Zhi-Quan;  Meng, Zhi-Chao;  Wu, Di;  Shang, Zhengang;  He, Xin
收藏  |  浏览/下载：70/0  |  提交时间：2021/02/02
The effect of finish layer on the interfacial cracking failure of Au-Si bonding 期刊论文
ENGINEERING FAILURE ANALYSIS, 2020, 卷号: 115, 页码: 8
作者:  Gao, Li-Yin;  Wen, Jian;  Li, Cai-Fu;  Chen, Chunhuan;  Liu, Zhi-Quan
收藏  |  浏览/下载：15/0  |  提交时间：2021/02/02
Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9
作者:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan
收藏  |  浏览/下载：46/0  |  提交时间：2021/02/02
Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9
作者:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan
收藏  |  浏览/下载：42/0  |  提交时间：2021/02/02
Influence of External Interface Normal Stress on the Growth of Cu-Sn IMC During Aging 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2020, 卷号: 33, 期号: 10, 页码: 9
作者:  Wang, Changchang;  Chen, Yinbo;  Liu, Zhi-Quan
收藏  |  浏览/下载：7/0  |  提交时间：2021/02/02
Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder 期刊论文
ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614
作者:  Cao Lihua;  Chen Yinbo;  Shi Qiyuan;  Yuan Jie;  Liu Zhiquan
收藏  |  浏览/下载：129/0  |  提交时间：2021/02/02
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
收藏  |  浏览/下载：26/0  |  提交时间：2021/02/02
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
收藏  |  浏览/下载：43/0  |  提交时间：2021/02/02

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