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浏览/检索结果: 共14条，第1-10条 帮助 限定条件 专题：华南理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Controllable Protein Adsorption and Bacterial Adhesion on Polypyrrole Nanocone Arrays (EI收录) 期刊论文 Journal of Materials Science and Technology, 2016, 卷号: 32, 页码: 950-955 作者:  Zhou, Zhengnan[1,2];  Li, Weiping[1,2];  He, Tianrui[1,2];  Yu, Peng[1,2];  Tan, Guoxin[3] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/24 Adsorption  Control  Nanostructures  Naphthalene  Polypyrroles  Proteins  Surface potential  Wetting   Facile Spray-Coating for Fabrication of Superhydrophobic SiO2/PVDF Nanocomposite Coating on Paper Surface (EI收录SCI收录) 期刊论文 Journal of Dispersion Science and Technology, 2016, 卷号: 37, 页码: 640-645 作者:  Shi, Yinlong[1];  Xiao, Xinyan[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/24 Coatings  Fabrication  Fluorine compounds  Fourier transform infrared spectroscopy  Hydrophobicity  Nanocomposite films  Nanocomposites  Paper  Scanning electron microscopy  Silanes  Silica  Sol  gel process  Spraying  Stainless steel  Wetting   Assembly route toward raspberry-like composite particles and their controlled surface wettability through varied dual-size binary roughness (EI收录) 期刊论文 Applied Surface Science, 2015, 卷号: 332, 页码: 393-402 作者:  Fan, Xin[1,2];  Niu, Lin[2];  Wu, Yuehuan[1];  Cheng, Jiang[2];  Yang, Zhuoru[2] 收藏  |  浏览/下载：10/0  |  提交时间：2019/04/25 Assembly  Composite materials  Sulfonation  Sulfur determination  Wetting   Synthesis and adhesion properties of waterborne polyurethane dispersions with long-branched aliphatic chains (EI收录) 期刊论文 Journal of Applied Polymer Science, 2015, 卷号: 132 作者:  Lei, Liang[1];  Xia, Zhengbin[1];  Lin, Xiaoqiong[1];  Yang, Tao[1];  Zhong, Li[1] 收藏  |  浏览/下载：25/0  |  提交时间：2019/04/25 Applications  Bond strength (materials)  Chains  Contact angle  Hydrophobicity  Nuclear magnetic resonance spectroscopy  Plastic films  Polyurethanes  Surface tension  Thermodynamic stability  Wetting   Construction of wettability gradient surface on copper substrate by controlled hydrolysis of poly (methyl methacrylate-butyl acrylate) films (EI收录SCI收录) 期刊论文 Applied Surface Science, 2014, 卷号: 315, 页码: 163-168 作者:  Zhang, Yong[1];  Cheng, Jiang[2];  Yang, Zhuo-Ru[2] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/25 Atomic force microscopy  Copolymers  Copper  Esterification  Esters  Field emission microscopes  Free radical polymerization  Hydrolysis  Polymerization  Scanning electron microscopy  Substrates  Wetting  X ray photoelectron spectroscopy   Directing the fate of human and mouse mesenchymal stem cells by hydroxyl-methyl mixed self-assembled monolayers with varying wettability (EI收录SCI收录) 期刊论文 Journal of Materials Chemistry B, 2014, 卷号: 2, 页码: 4794-4801 作者:  Hao, Lijing[1,2];  Yang, Hui[1,2];  Du, Chang[1,2];  Fu, Xiaoling[1,2];  Zhao, Naru[1,2] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/25 Adhesion  Biological materials  Contact angle  Flowcharting  Hydrophilicity  Mammals  Self assembled monolayers  Stem cells  Surface chemistry  Wetting   Comparison of static contact angle of various metal foams and porous copper fiber sintered sheet (EI收录) 期刊论文 Applied Surface Science, 2013, 卷号: 276, 页码: 377-382 作者:  Zhang, Chunjian[2];  Zhou, Wei[1,2];  Wang, Qinghui[3];  Wang, Hongbin[2];  Tang, Yong[3] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/25 Contact angle  Copper  Electric contacts  Foams  Metals  Porosity  Surface morphology  Wetting   Study on the wetting behavior and theoretical models of polydimethylsiloxane/silica coating (EI收录) 期刊论文 Applied Surface Science, 2013, 卷号: 279, 页码: 458-463 作者:  Li, Kunquan[1];  Zeng, Xingrong[1];  Li, Hongqiang[1];  Lai, Xuejun[1];  Ye, Chaoxian[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/25 Coatings  Contact angle  Drops  Microchannels  Silica  Silicones  Surface chemistry  Wetting   Dynamic wetting behavior and solder ball spattering formation of Sn-Bi solder pastes during reflow soldering process (CPCI-S收录) 会议 作者:  Tan, Meng-Ying;  Zhou, Min-Bo;  Huang, Lia-Qiang;  Ma, Fa-Qian;  Ma, Xiao 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/11 surface defect  solder ball spattering  Sn-Bi solder paste  reflow soldering process   Effect of activators and surfactants in halogen-free fluxes on wettability of Sn-0.7Cu-0.05Ni solder on Cu substrate (EI收录) 会议论文 Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, China, August 11, 2013 - August 14, 2013 作者:  Li, Chang-Zheng[1];  Yan, Mo-Yang[1];  Zhou, Min-Bo[1];  Ma, Xiao[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 Electronics packaging  Nickel  Soldering  Soldering alloys  Substrates  Surface active agents  Wetting