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科研机构
大连理工大学 [36]
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期刊论文 [34]
会议论文 [2]
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2019 [3]
2018 [4]
2017 [6]
2016 [7]
2013 [1]
2010 [2]
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专题:大连理工大学
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Size effect on interface reaction of Sn-xCu/Cu solder joints during multiple reflows
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 4359-4369
作者:
Huang, Ru
;
Ma, Haoran
;
Shang, Shengyan
;
Kunwar, Anil
;
Wang, Yunpeng
收藏
  |  
浏览/下载:26/0
  |  
提交时间:2019/12/02
Chip scale packages
Copper
Copper alloys
Flip chip devices
Grain boundaries
Growth rate
Size determination
Soldered joints
Substrates
Tin alloys, Electronic product
Grain boundary motions
Interface reactions
Lateral growth rates
Longitudinal growth
Packaging process
Packaging technologies
Solder composition, Soldering
Growth behavior of preferentially scalloped intermetallic compounds at extremely thin peripheral Sn/Cu interface
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 2872-2887
作者:
Shang, Shengyan
;
Kunwar, Anil
;
Wang, Yanfeng
;
Qu, Lin
;
Ma, Haitao
收藏
  |  
浏览/下载:26/0
  |  
提交时间:2019/12/02
Binary alloys
Copper alloys
Film thickness
Intermetallics
Lead-free solders
Molluscs
Ostwald ripening
Soldering
Tin alloys, Cooling rates
Furnace cooling
Grain diameter
Growth behavior
Growth behaviour
Layer thickness
Non-uniformities
Reflow temperatures, Cooling
Grain nucleation and growth behavior of (Cu, Ni)6Sn5 in Sn�C10Cu�C1Ni alloy under pulse current: An in situ observation
期刊论文
Materials Characterization, 2019, 卷号: 158
作者:
Gao, Bingyang
;
Guo, Enyu
;
Meng, Xiangrui
;
Nie, Shuang
;
Liang, Hui
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/12/02
Growth mechanism of Cu3Sn grains in the (111)Cu/Sn/Cu micro interconnects
会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:
Zhong, Yi
;
Zhao, Ning
;
Dong, Wei
;
Wang, Yunpeng
;
Ma, Haitao
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/12/02
electronic packaging
soldering
intermetallic compound
grain orientation
temperature gradient
anisotropy
Formation of large grains by epitaxial and abnormal growth at the surface of pulsed electron beam treated metallic samples
期刊论文
MATERIALS & DESIGN, 2018, 卷号: 159, 页码: 1-10
作者:
Yan, Ping
;
Grosdidier, Thierry
;
Zhang, Xiangdong
;
Zou, Jianxin
收藏
  |  
浏览/下载:14/0
  |  
提交时间:2019/12/02
Surface treatment
High current pulsed electron beam (HCPEB)
Epitaxial growth
Abnormal grain growth
Al 2024 alloy
Single grain superalloys
The influence of nanoparticles on dendritic grain growth in Mg alloys
期刊论文
ACTA MATERIALIA, 2018, 卷号: 152, 页码: 127-137
作者:
Guo, Enyu
;
Shuai, Sansan
;
Kazantsev, Daniil
;
Karagadde, Shyamprasad
;
Phillion, A. B.
收藏
  |  
浏览/下载:9/0
  |  
提交时间:2019/12/02
Metal matrix nanocomposites
Dendritic solidification
Nanoparticles
Tomography
Iterative image reconstruction
3D Monte Carlo simulation of grain growth in friction stir welding
期刊论文
JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY, 2018, 卷号: 32, 页码: 1287-1296
作者:
Zhang, Z.
;
Hu, C. P.
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/12/02
Friction stir welding
Grain growth
Monte Carlo method
Fluid turbulence model
Finite element modeling of grain growth by point tracking method in friction stir welding of AA6082-T6
期刊论文
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2017, 卷号: 90, 页码: 3567-3574
作者:
Wan, Z. Y.
;
Zhang, Z.
;
Zhou, X.
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/12/02
Friction stir welding
Coupled thermo-mechanical model
Material flow
Grain size
Precipitation-Induced Grain Growth Simulation of Friction-Stir-Welded AA6082-T6
期刊论文
JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE, 2017, 卷号: 26, 页码: 2179-2189
作者:
Wu, Q.
;
Zhang, Z.
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/12/02
friction stir welding
grain size
Monte Carlo method
precipitation
Finite element modelling of grain growth by point tracking method in friction stir welding of AA6082-T6
期刊论文
International Journal of Advanced Manufacturing Technology, 2017, 卷号: 90, 页码: 3567-3574
作者:
Zhang Z(张昭)
;
Zhou X(周霞)
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/12/03
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