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Iodide-induced galvanic replacement of nickel film on copper as activator for electroless nickel-phosphorus plating 期刊论文
Materials Letters, 2022, 卷号: 314
作者:  Zhao, Qiuping;  Hu, Guanqun;  Huang, Rui;  Qiang, Li;  Zhang, Xingkai
收藏  |  浏览/下载:17/0  |  提交时间:2022/04/21
Facile galvanic replacement deposition of nickel on copper substrate in deep eutectic solvent and its activation ability for electroless Ni–P plating 期刊论文
Journal of Solid State Electrochemistry, 2022, 卷号: 26, 期号: 5, 页码: 1313-1322
作者:  Hu, Guanqun;  Huang, Rui;  Wang, Hongli;  Zhao, Qiuping;  Zhang, Xingkai
收藏  |  浏览/下载:37/0  |  提交时间:2022/06/20
Effect of Tin Addition on the Properties of Electroless Ni-P-Sn Ternary Deposits 期刊论文
MATERIALS TRANSACTIONS, 2010, 卷号: 51, 期号: 2, 页码: 277-281
作者:  Zou, Yong;  Cheng, YanHai;  Cheng, Lin;  Liu, Wen
收藏  |  浏览/下载:1/0  |  提交时间:2019/12/26
Electrolessly plated Ni-Zn(Fe)-P alloy and its corrosion resistance properties 期刊论文
2005
WANG Sen-lin; WU Hui-huang; 吴辉煌
收藏  |  浏览/下载:3/0  |  提交时间:2011/11/16
Ni(HP)及NiCuP合金的自催化沉积过程与镀层的结构性能研究 学位论文
2003, 2000
蒋太祥
收藏  |  浏览/下载:1/0  |  提交时间:2016/02/14
Studies on microstructure and crystallization behavior of electroless nickel-high phosphorus coatings 期刊论文
2001
Jiang, TX; 蒋太祥; 吴辉煌; Wu, HH
收藏  |  浏览/下载:4/0  |  提交时间:2012/06/04


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