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期刊论文 [21]
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A new multiaxial fatigue life prediction model for aircraft aluminum alloy
期刊论文
INTERNATIONAL JOURNAL OF FATIGUE, 2021, 卷号: 143, 页码: 16
作者:
Zhao, Bingfeng
;
Xie, Liyang
;
Wang, Lei
;
Hu, Zhiyong
;
Zhou, Song
收藏
  |  
浏览/下载:14/0
  |  
提交时间:2021/03/15
Multiaxial fatigue life prediction
Aircraft aluminum alloy
Critical plane approach
Additional hardening
Non-proportional loading
An improved dynamic load-strength interference model for the reliability analysis of aero-engine rotor blade system
期刊论文
PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART G-JOURNAL OF AEROSPACE ENGINEERING, 2020, 页码: 19
作者:
Zhao, Bingfeng
;
Xie, Liyang
;
Zhang, Yu
;
Ren, Jungang
;
Bai, Xin
收藏
  |  
浏览/下载:98/0
  |  
提交时间:2021/10/15
Aero-engine
rotor blade
load-strength interference
reliability analysis
strength degradation
Has the public lost confidence in vaccines because of a vaccine scandal in China
期刊论文
VACCINE, 2019, 卷号: 37, 页码: 5270-5275
作者:
Han, Bingfeng
;
Wang, Shuai
;
Wan, Yongmei
;
Liu, Jiang
;
Zhao, Tianshuo
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2019/12/30
Vaccine
Scandal
Confidence
Regulation
Adiabatic shear localization in the CrMnFeCoNi high-entropy alloy
期刊论文
Acta Materialia, 2018, 卷号: 151, 页码: 424-431
作者:
Li, Zezhou
;
Zhao, Shiteng
;
Alotaibi, Senhat M.
;
Liu, Yong
;
Wang, Bingfeng
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  |  
浏览/下载:5/0
  |  
提交时间:2019/12/03
The CrMnFeCoNi HEA
Mechanical response
Adiabatic shear band
Synchrotron radiation imaging study on the rapid IMC growth of Sn-xAg solders with Cu and Ni substrates during the heat preservation stage
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 页码: 589-601
作者:
Guo, Bingfeng
;
Kunwar, Anil
;
Jiang, Chengrong
;
Zhao, Ning
;
Sun, Junhao
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  |  
浏览/下载:4/0
  |  
提交时间:2019/12/02
Roles of interfacial heat transfer and relative solder height on segregated growth behavior of intermetallic compounds in Sn/Cu joints during furnace cooling
期刊论文
INTERMETALLICS, 2018, 卷号: 93, 页码: 186-196
作者:
Kunwar, Anil
;
Guo, Bingfeng
;
Shang, Shengyan
;
Raback, Peter
;
Wang, Yunpeng
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  |  
浏览/下载:4/0
  |  
提交时间:2019/12/02
Intermetallics
Anisotropy
Joining
Microstructure
Finite-element modeling
Electron microscopy, scanning
Effect of Ag3Sn nanoparticles and temperature on Cu6Sn5 IMC growth in Sn-xAg/Cu solder joints
期刊论文
MATERIALS RESEARCH BULLETIN, 2018, 卷号: 99, 页码: 239-248
作者:
Guo, Bingfeng
;
Kunwar, Anil
;
Zhao, Ning
;
Chen, Jun
;
Wang, Yunpeng
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/12/02
Electronic materials
Intermetallic compounds
Microstructure
Electron microscopy
Diffusion
Pharmacokinetics and Preliminary Pharmacodynamics of Single- and Multiple-dose Lyophilized Recombinant Glucagon-like Peptide-1 Receptor Agonist (rE-4) in Chinese Patients with Type 2 Diabetes Mellitus
期刊论文
CLINICAL DRUG INVESTIGATION, 2017, 卷号: 37, 期号: 12
作者:
Fang, Yi
;
Xu, Bingfeng
;
Zhu, Lixia
;
Wang, Yitong
;
Lou, Kun
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2019/12/05
Formation mechanism and kinetic analysis of the morphology of Cu6Sn5 in the spherical solder joints at the Sn/Cu liquid-solid interface during soldering cooling stage
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2017, 卷号: 28, 页码: 5398-5406
作者:
Guo, Bingfeng
;
Ma, Haitao
;
Jiang, Chengrong
;
Wang, Yunpeng
;
Kunwar, Anil
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2019/12/02
In situ study the effects of Cu addition on the rapidly growth of Cu6Sn5 at the Sn-base solder/Cu L-S interface during soldering heat preservation stage
会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:
Guo, Bingfeng
;
Jiang, Chengrong
;
Kunwar, Anil
;
Chen, Jun
;
Zhao, Ning
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/12/03
Synchrotron radiation
heat preservation stage
microstructure
Cu addition
mechanism
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