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科研机构
深圳先进技术研究院 [8]
中国石油大学(北京) [7]
中国科学院大学 [5]
内容类型
会议论文 [15]
期刊论文 [5]
发表日期
2018 [1]
2017 [6]
2016 [7]
2015 [1]
2009 [1]
2007 [3]
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Preparation and characterization of the double-side adhesive tape with reactive properties and high thermal conductivity for electronic packaging
会议论文
上海, 2018
作者:
Chang Hao
;
Zhang Baotan
;
Sun Rong
收藏
  |  
浏览/下载:30/0
  |  
提交时间:2019/01/31
Synthesis and characterization of silica–silver core-shell structural spheres and its application in conductive adhesive
会议论文
Harbin, China
作者:
Jinze Li
;
Baotan Zhang
;
Pengli Zhu
;
Yuan Gao
;
Rong Sun
收藏
  |  
浏览/下载:18/0
  |  
提交时间:2018/02/02
Liquid Epoxy Molding Compound with High Glass Transition Temperature and High Thermal Conductivity
会议论文
Harbin, China
作者:
Jinze Li
;
Baotan Zhang
;
Pengli Zhu
;
Gang Li
;
Rong Sun
收藏
  |  
浏览/下载:18/0
  |  
提交时间:2018/02/02
Synthesis and characterization of silica-silver core-shell structural spheres and its application in conductive adhesive
会议论文
18th International Conference on Electronic Packaging Technology (ICEPT), IEEE, Harbin, PEOPLES R CHINA
作者:
Li, Jinze
;
Zhang, Baotan
;
Zhu, Pengli
;
Gao, Yuan
;
Sun, Rong
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2020/01/03
SiO2@Ag hybrid particles
conductive adhesive
sintered
thermal expansion coefficient
Liquid Epoxy Molding Compound with High Glass Transition Temperature and High Thermal Conductivity
会议论文
18th International Conference on Electronic Packaging Technology (ICEPT), IEEE, Harbin, PEOPLES R CHINA
作者:
Li, Jinze
;
Zhang, Baotan
;
Zhu, Pengli
;
Li, Gang
;
Sun, Rong
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2020/01/03
Fan-out Wafer Level Package
EMC
Thermal conductivity
Glass transition temperature
Synthesis and characterization of silica-silver core-shell structural spheres and its application in conductive adhesive
会议论文
18th International Conference on Electronic Packaging Technology, ICEPT 2017, Harbin, China, 2017-08-16
作者:
Li, Jinze
;
Zhang, Baotan
;
Zhu, Pengli
;
Gao, Yuan
;
Sun, Rong
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2020/01/03
Liquid epoxy molding compound with high glass transition temperature and high thermal conductivity
会议论文
18th International Conference on Electronic Packaging Technology, ICEPT 2017, Harbin, China, 2017-08-16
作者:
Li, Jinze
;
Zhang, Baotan
;
Zhu, Pengli
;
Li, Gang
;
Sun, Rong
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2020/01/03
Novel Underfill Material Having Low Coefficeint of Thermal Expansione
会议论文
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者:
Zhang Baotan
;
Sun Rong
;
Zhu Pengli
收藏
  |  
浏览/下载:16/0
  |  
提交时间:2017/01/15
Cure kinetics study of a Novel Die Attach Adhesive for High Power Light-Emitting Diode
会议论文
China Semiconductor Technology International Conference 2016, CSTIC 2016, Shanghai, China
作者:
Baotan Zhang
;
Rong Sun
;
Yankang Han
;
Pengli Zhu
;
Daoqiang(Daniel) Lu
收藏
  |  
浏览/下载:28/0
  |  
提交时间:2017/01/15
Preparation of highly conductive adhesives by in-stiu incorporation of silver nanoparticles
会议论文
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者:
Yankang Han
;
Baotan Zhang
;
Pengli Zhu
;
Shulei Huang
;
Qianqian Liu
收藏
  |  
浏览/下载:32/0
  |  
提交时间:2017/01/15
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