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	Liquid Epoxy Molding Compound with High Glass Transition Temperature and High Thermal Conductivity
	Jinze Li; Baotan Zhang; Pengli Zhu; Gang Li; Rong Sun; Chingping Wong
	2017
会议地点	Harbin, China
英文摘要	The novel liquid epoxy moulding compound (EMC) material with high thermally conductive and good heated resistance was prepared by epoxy, cyanate and alumina filler. Rheological properties, curing behaviors, mechanical and thermal properties of the resultant materials were investigated by rheometer, DSC, SEM, TGA, TMA and DMA, respectively. The results showed that the cyanate ester modified epoxy and its composite with alumina filler made the glass transition temperature over 212.7 °C and the thermal decomposition temperature (5% wt loss) up to 410 °C, indicating that it has good thermal stability. With an increase in Al2O3 fillers loading, the coefficient of thermal conductivity rose from 0.21 to 2.87 W/m·K at 90 wt% fillers. This indicated that the novel EMC material has excellent thermally conductivity, which can be used for fan-out wafer level packages.
语种	英语
内容类型	会议论文
源URL	[http://ir.siat.ac.cn:8080/handle/172644/11836]
专题	深圳先进技术研究院_集成所
作者单位	2017
推荐引用方式 GB/T 7714	Jinze Li,Baotan Zhang,Pengli Zhu,et al. Liquid Epoxy Molding Compound with High Glass Transition Temperature and High Thermal Conductivity[C]. 见:. Harbin, China.

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