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	Cure kinetics study of a Novel Die Attach Adhesive for High Power Light-Emitting Diode
	Baotan Zhang; Rong Sun; Yankang Han; Pengli Zhu; Daoqiang(Daniel) Lu; Chingping Wong
	2016
会议名称	China Semiconductor Technology International Conference 2016, CSTIC 2016
会议地点	Shanghai, China
英文摘要	The curing behavior and kinetics of alicyclic epoxy resin (ERL-4221) and bisphenol F epoxy resin (DER-354) using triarylsulfonium hexafluoroantimonates(TASH) as the cationic initiators were studied by differential scanning calorimetry (DSC) at different heating rates. Kinetic parameters of the curing process were calculated and established by the Kissinger, Ozawa and Crane methods. The results showed that the activity of ERL-4221 system was obviously higher than that of DER-354 system in the cationic polymerization system initiated by TASH. Non-Isothermal DSC experiments have confirmed these findings. At the same time, the the kinetic parameters of ERL-4221 and DER-354 systems were corresponding to 87.04 kJ/mol, 2.15×108s-1, 0.9763 and 75.56 kJ/mol, 4.81 × 106s-1, 0.9610, by the Kissinger and Crane method, and the curing reactions both followed the first order reaction kinetics mechanism. The Ozawa method also obtained similar results.
收录类别	EI
语种	英语
内容类型	会议论文
源URL	[http://ir.siat.ac.cn:8080/handle/172644/10094]
专题	深圳先进技术研究院_集成所
作者单位	2016
推荐引用方式 GB/T 7714	Baotan Zhang,Rong Sun,Yankang Han,et al. Cure kinetics study of a Novel Die Attach Adhesive for High Power Light-Emitting Diode[C]. 见:China Semiconductor Technology International Conference 2016, CSTIC 2016. Shanghai, China.

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