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浏览/检索结果: 共9条，第1-9条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Exploration and validation of radiomics signature as an independent prognostic biomarker in stage III-IVb nasopharyngeal carcinoma 期刊论文 2017, 卷号: 8, 期号: 43, 页码: 74869 作者:  Ouyang, Fu-sheng[1];  Guo, Bao-liang[1];  Zhang, Bin[2,3];  Dong, Yu-hao[4];  Zhang, Lu[4] 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/10 CT and MRI findings in focal eosinophilic infiltration of the liver 期刊论文 2017, 卷号: 42, 期号: 12, 页码: 2874 作者:  Guo, Bao-liang[1];  Hu, Qiu-gen[1];  Ouyang, Fu-sheng[1];  Zhang, Bin[2,3];  Dong, Yu-hao[4] 收藏  |  浏览/下载：8/0  |  提交时间：2019/12/13 Morphological evolution and migration behavior of the microvoid in Sn/Cu interconnects under electrical field studied by phase-field simulati (CPCI-S收录) 会议 作者:  Liang, Shui-Bao[1];  Ke, Chang-Bo[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 microvoids  solder interconnect  electrical field  phase field simulation   Phase field crystal simulation of morphological evolution and growth kinetics of Kirkendall voids at the interface and in the intermetallic c (CPCI-S收录) 会议 作者:  Ma, Wen-Jing[1];  Ke, Chang-Bo[1];  Liang, Shui-bao[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：16/0  |  提交时间：2019/04/11 Kirkendall void  growth exponent  morphological evolution  cyclic loading  phase field cystal model   Phase Field Simulation of Segregation of the Bi-riched Phase in Cu/Sn-Bi/Cu Solder Interconnects under Electric Current Stressing (CPCI-S收录) 会议 作者:  Liang, Shui-Bao[1];  Ke, Chang-Bo[1];  Ma, Wen-Jing[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 segregation  electromigration  Sn-Bi solder  interconnect  phase field simulation   Finite element simulation of the size effect on thermal fatigue behavior of solder bump joints in TSV structure (CPCI-S收录) 会议 作者:  Jiang, Han[1];  Liang, Shui-Bao[1];  Yuwen, Hui-Hui[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 TSV  solder bump joint  thermal fatigue  size effect  finite element analysis   Phase field simulation of the microstructural evolution and electromigration-induced phase segregation in line-type Cu/Sn-Bi/Cu solder interc (CPCI-S收录) 会议 作者:  Liang, Shui-Bao;  Ke, Chang-Bo;  Tan, Meng-Ying;  Zhou, Min-Bo;  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 electromigration  microstructure evolution  phase segregation  Cu/Sn-Bi/Cu interconnect  phase field simulation   Phase field simulation of morphological evolution and migration of the microvoid in small scale solder interconnects driven by temperature gr (CPCI-S收录) 会议 作者:  Liang, Shui-Bao;  Ke, Chang-Bo;  Zhou, Min-Bo;  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/11 micro voids  temperature gradient  thermomigration  solder interconnect  phase field simulation   Phase field simulation of Kirkendall voids at the interface of microscale Sn/Cu system lead-free interconnects (CPCI-S收录) 会议论文 2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) 作者:  Liang, Shui-Bao[1];  Ke, Chang-Bo[1];  Ma, Wen-Jing[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/12 Kirkendall voids  Microscale lead-free solder interconnect  Soldering reaction  Phase field crystal simulation