| Phase field simulation of morphological evolution and migration of the microvoid in small scale solder interconnects driven by temperature gr (CPCI-S收录) | |
| Liang, Shui-Bao; Ke, Chang-Bo; Zhou, Min-Bo; Zhang, Xin-Ping[1] | |
| 关键词 | micro voids temperature gradient thermomigration solder interconnect phase field simulation |
| URL标识 | 查看原文 |
| 内容类型 | 会议 |
| URI标识 | http://www.corc.org.cn/handle/1471x/2039800 |
| 专题 | 华南理工大学 |
| 推荐引用方式 GB/T 7714 | Liang, Shui-Bao,Ke, Chang-Bo,Zhou, Min-Bo,等.Phase field simulation of morphological evolution and migration of the microvoid in small scale solder interconnects driven by temperature gr (CPCI-S收录). |
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