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CORC

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Evaluation and Optimization of Thermo-Mechanical Reliability of a TSV-based 3D MEMS 其他
2016-01-01
Zeng, Qinghua; Guan, Yong; Chen, Jing; Meng, Wei; Jin, Yufeng
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
Simulation and evaluation of thermal mechanical reliability of 3D-TSV stack with viscoelastic underfill 其他
2016-01-01
Zeng, Qinghua; Guan, Yong; Su, Fei; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
Evaluation of Thermal Mechanical Reliability of Three Dimensional Packaging System with Redundant TSVs 其他
2016-01-01
Zeng, Qinghua; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03
Simulation and Evaluation of Thermal Mechanical Reliability of 3D-TSV Stack with Viscoelastic Underfill 其他
2015-01-01
Zeng, Qinghua; Guan, Yong; Su, Fei; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：4/0  |  提交时间：2017/12/03
Wafer-Level Vacuum Packaging for MEMS Resonators Using Glass Frit Bonding 期刊论文
journal of microelectromechanical systems, 2012
Wu, Guoqiang; Xu, Dehui; Xiong, Bin; Wang, Yuchen; Wang, Yuelin; Ma, Yinglei
收藏  |  浏览/下载：14/0  |  提交时间：2015/11/12
Understanding Effect of Additives in Copper Electroplating Filling for Through Silicon Via 其他
2012-01-01
Miao, Min; Zhu, Yunhui; Bian, Yuan; Sun, Xin; Ma, Shenglin; Cui, Qinghu; Zhong, Xiao; Fang, Runiu; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：4/0  |  提交时间：2015/11/16
Wafer-Level Vacuum Packaging for MEMS Resonators Using Glass Frit Bonding 期刊论文
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2012, 卷号: 21, 期号: 6, 页码: 1484-1491
Wu, GQ; Xu, DH; Xiong, B; Wang, YC; Wang, YL; Ma, YL
收藏  |  浏览/下载：102/0  |  提交时间：2013/04/23
Redistribution of Electrical Interconnections for Three-Dimensional Wafer-Level Packaging With Silicon Bumps 期刊论文
IEEE ELECTRON DEVICE LETTERS, 2012, 卷号: 33, 期号: 8, 页码: 1177-1179
Wu, GQ; Xu, DH; Xiong, B; Wang, YL
收藏  |  浏览/下载：17/0  |  提交时间：2013/04/23
Wafer level optoelectronic package with fiber side insertion 专利
专利号: US7703993, 申请日期: 2010-04-27, 公开日期: 2010-04-27
作者:  DARBINYAN, ARTUR;  NGUYEN, LUU;  PODDAR, ANINDYA
收藏  |  浏览/下载：13/0  |  提交时间：2019/12/24
A mems probe card with 2d dense-arrayed 'hoe'-shaped metal tips 期刊论文
Journal of micromechanics and microengineering, 2008, 卷号: 18, 期号: 5, 页码: 8
作者:  Wang, Fei;  Li, Xinxin;  Feng, Songlin
收藏  |  浏览/下载：11/0  |  提交时间：2019/05/10

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