Wafer-Level Vacuum Packaging for MEMS Resonators Using Glass Frit Bonding

	Wafer-Level Vacuum Packaging for MEMS Resonators Using Glass Frit Bonding
	Wu, GQ ; Xu, DH ; Xiong, B ; Wang, YC ; Wang, YL ; Ma, YL
刊名	JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
	2012
卷号	21 期号:6 页码:1484-1491
关键词	Bulk mode glass frit bonding microelectromechanical systems (MEMS) redistribution resonators silicon bumps vacuum package wafer-level package
ISSN号	1057-7157
通讯作者	Wu, GQ (reprint author), Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, State Key Lab Transducer Technol, Shanghai 200050, Peoples R China.
中文摘要	A wafer-level vacuum package with silicon bumps and electrical feedthroughs on the cap wafer is developed for a microelectromechanical systems (MEMS) resonator device. A MEMS resonator wafer and a cap wafer are bonded together in a vacuum chamber using gl
学科主题	Engineering
收录类别	2012SCI-004
原文出处	10.1109/JMEMS.2012.2211572
语种	英语
公开日期	2013-04-23
内容类型	期刊论文
源URL	[http://ir.sim.ac.cn/handle/331004/114888]
专题	上海微系统与信息技术研究所_微系统技术_期刊论文
推荐引用方式 GB/T 7714	Wu, GQ,Xu, DH,Xiong, B,et al. Wafer-Level Vacuum Packaging for MEMS Resonators Using Glass Frit Bonding[J]. JOURNAL OF MICROELECTROMECHANICAL SYSTEMS,2012,21(6):1484-1491.
APA	Wu, GQ,Xu, DH,Xiong, B,Wang, YC,Wang, YL,&Ma, YL.(2012).Wafer-Level Vacuum Packaging for MEMS Resonators Using Glass Frit Bonding.JOURNAL OF MICROELECTROMECHANICAL SYSTEMS,21(6),1484-1491.
MLA	Wu, GQ,et al."Wafer-Level Vacuum Packaging for MEMS Resonators Using Glass Frit Bonding".JOURNAL OF MICROELECTROMECHANICAL SYSTEMS 21.6(2012):1484-1491.