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CORC

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Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 15
作者:  Chen, Yinbo;  Meng, Zhi-Chao;  Gao, Li-Yin;  Liu, Zhi-Quan
收藏  |  浏览/下载：12/0  |  提交时间：2021/03/15
Predicting the variation of stacking fault energy for binary Cu alloys by first-principles calculations 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2020, 卷号: 53, 页码: 61-65
作者:  Cai, T.;  Li, K. Q.;  Zhang, Z. J.;  Zhang, P.;  Liu, R.
收藏  |  浏览/下载：32/0  |  提交时间：2021/02/02
Wetting of Ni-based amorphous and crystalline alloys by Sn and Sn-based solders 期刊论文
Microelectronics Reliability, 2020, 卷号: 111
作者:  Lin, Qiaoli;  Ye, Changsheng;  Sui, Ran
收藏  |  浏览/下载：3/0  |  提交时间：2020/11/14
Wetting Behavior of Molten SnAgCu-xTi on SiO2 Surface Under High Temperature 期刊论文
Cailiao Daobao/Materials Reports, 2020, 卷号: 34, 期号: 5, 页码: 10114-10119
作者:  Wang, Jianbin;  Lin, Qiaoli;  Sui, Ran;  Ci, Wenjuan;  Ye, Changsheng
收藏  |  浏览/下载：2/0  |  提交时间：2020/11/14
Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder 期刊论文
ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614
作者:  Cao Lihua;  Chen Yinbo;  Shi Qiyuan;  Yuan Jie;  Liu Zhiquan
收藏  |  浏览/下载：129/0  |  提交时间：2021/02/02
Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 16, 页码: 15054-15063
作者:  Zhao, Meng;  Zhang, Liang
收藏  |  浏览/下载：19/0  |  提交时间：2021/02/02
Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 16, 页码: 15054-15063
作者:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-quan;  Xiong, Ming-yue;  Sun, Lei
收藏  |  浏览/下载：23/0  |  提交时间：2021/02/02
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
收藏  |  浏览/下载：26/0  |  提交时间：2021/02/02
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
收藏  |  浏览/下载：43/0  |  提交时间：2021/02/02
Reactive wetting of amorphous silica by Sn0.3Ag0.7Cu-xTi (x = 1 and 3wt.%)alloys at 800–900°C 期刊论文
Ceramics International, 2019, 卷号: 45, 期号: 10, 页码: 12920-12925
作者:  Sui, Ran;  Wang, Jianbin;  Ci, Wenjuan;  Lin, Qiaoli;  Yang, Hongyu
收藏  |  浏览/下载：25/0  |  提交时间：2020/11/14

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