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| Thermal-Mechanical Reliability Assessment of TSV Structure for 3D IC Integration 会议论文
18th IEEE Electronics Packaging Technology Conference (EPTC), Singapore, SINGAPORE, 2016-11-30
作者: Liu, Huan; Zeng, Qinghua; Guan, Yong; Fang, Runiu; Sun, Xin
  收藏 | 浏览/下载：5/0 | 提交时间：2019/12/30
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| Hypsodonty in Mammals: Evolution, Geomorphology and the Role of Earth Surface Processes 专著
UK:Cambridge University Press, 1st edition, 2015
Richard H. Madden
收藏 | 浏览/下载：14/0 | 提交时间：2015/12/29 |
| Research of PROFIBUS PA’s integration in PROFINET IO 会议论文
2015 3rd International Conference on Material, Mechanical and Manufacturing Engineering (IC3ME 2015), Guangzhou, China, June 27-28, 2015
作者: Yang ZJ(杨志家) ; Li ZS(李中胜); Qiao, Feng; Min MH(闵明慧)
收藏 | 浏览/下载：15/0 | 提交时间：2015/12/19
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| A study of underfill using two kinds of Silica as inorganic filler 会议论文
2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, China
作者: Zhang Wenjie; Zhu Pengli; Zhao Tao; Sun Rong; Wong Chingping
收藏 | 浏览/下载：6/0 | 提交时间：2015/08/27 |
| Combination approach of FEM and circuit system in IR drop analysis and its applications 期刊论文
2010, 2010
Tang Zhanghong; Yuan Jiansheng
收藏 | 浏览/下载：6/0 |
| 废旧塑封芯片重用中的分层缺陷研究 会议论文
第四届世界维修大会, CNKI
丁晓宇; 刘学平; 向东; 杨继平; 段广洪; Xiaoyu Ding; Xueping Liu; Dong Xiang; Jiping Yang; Guanghong Duan
收藏 | 浏览/下载：4/0 | 提交时间：2017/06/15
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| 塑封芯片烘烤过程的有限元分析 期刊论文
2010, 2010
丁晓宇; 向东; 杨继平; 段广洪; DING Xiao-yu; XIANG Dong; YANG Ji-ping; DUAN Guang-hong
收藏 | 浏览/下载：1/0 |
| Combination Approach of FEM and Circuit System in IR Drop Analysis and Its Applications 期刊论文
2010, 2010
唐章宏; 袁建生; TANG Zhanghong; YUAN Jiansheng
收藏 | 浏览/下载：3/0 |
| Electro-thermal simulation of integrated circuits using finite difference method 期刊论文
2010, 2010
Wang Nai-Long; Liu Miao; Zhou Run-de
收藏 | 浏览/下载：2/0 |
| The Diatoms_ Applications for the Environmental and Earth Sciences, 2nd Edition 专著
UK:Cambridge University Press, 2010
John P. Smol (Editor); Eugene F. Stoermer (Editor)
收藏 | 浏览/下载：73/0 | 提交时间：2016/01/11 |
