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浏览/检索结果: 共8条，第1-8条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Thermal analysis of a power box 会议论文 International Conference on Manufacturing and Engineering Technology, ICMET 2014, Sanya, China, October 17, 2014 - October 19, 2014 作者:  Chen, B;  Li, N. 收藏  |  浏览/下载：13/0  |  提交时间：2016/04/08 Thermal analysis of a satellite instrument 会议论文 AIAA AVIATION 2014 -11th AIAA/ASME Joint Thermophysics and Heat Transfer Conference 2014, Atlanta, GA, United states, June 16, 2014 - June 20, 2014 作者:  Chen, Bo 收藏  |  浏览/下载：35/0  |  提交时间：2015/09/18 Thermal analysis of a satellite Borne instrument 会议论文 2014 2nd International Conference on Mechatronics, Robotics and Automation, ICMRA 2014, Zhuhai, China, March 8, 2014 - March 9, 2014 作者:  Chen, Bo;  Li, Ning 收藏  |  浏览/下载：23/0  |  提交时间：2014/07/14 Thermal simulation of an electric box 会议论文 2014 International Conference on Manufacturing Technology and Electronics Applications, ICMTEA 2014, Taiyuan, China, November 8, 2014 - November 9, 2014 作者:  Chen, Bo;  Chen, Bo 收藏  |  浏览/下载：11/0  |  提交时间：2016/01/05 Thermal Design, Analysis and Experimental Verification of Electronic Equipment of a Satellite Borne Microwave Radiometer 期刊论文 ENGINEERING SOLUTIONS FOR MANUFACTURING PROCESSES, PTS 1-3, 2013, 卷号: 655-657, 页码: 84-87 作者:  Chen, Bo 收藏  |  浏览/下载：26/0  |  提交时间：2014/05/04 Thermal simulation  Thermal analysis  CAE  Derated maximum junction temperature   Thermal Design of a Satellite Borne FPGA 会议论文 1st International Conference on Mechanical Engineering, Phuket, THAILAND, APR 03-04, 2011 作者:  Chen, Bo 收藏  |  浏览/下载：14/0  |  提交时间：2014/12/15 Thermal simulation  Thermal analysis  Finite element analysis  CAE  Derated maximum junction temperature   Thermal Design, Analysis and Experimental Verification of a Satellite Borne Electronic Equipment 会议论文 International Conference on Advances in Materials and Manufacturing Processes, Shenzhen, PEOPLES R CHINA, NOV 06-08, 2010 作者:  Chen, Bo 收藏  |  浏览/下载：13/0  |  提交时间：2014/12/15 Thermal simulation  Thermal analysis  Finite element analysis  CAD  Derated maximum junction temperature   Thermal Design and Analysis of a Satellite Borne Electronic PCB 会议论文 2nd International Conference on Manufacturing Science and Engineering, Guilin, PEOPLES R CHINA, APR 09-11, 2011 作者:  Chen, Bo 收藏  |  浏览/下载：8/0  |  提交时间：2014/12/15 Thermal Simulation  Thermal Analysis  Finite Element Analysis  CAE  Derated Maximum Junction Temperature