Thermal Design and Analysis of a Satellite Borne Electronic PCB

	Thermal Design and Analysis of a Satellite Borne Electronic PCB
	Chen, Bo
	2011
会议名称	2nd International Conference on Manufacturing Science and Engineering
会议日期	APR 09-11, 2011
会议地点	Guilin, PEOPLES R CHINA
关键词	Thermal Simulation Thermal Analysis Finite Element Analysis CAE Derated Maximum Junction Temperature
页码	1551-1554
通讯作者	Chen, B (reprint author), Chinese Acad Sci, Ctr Space Sci & Appl Res, Beijing 100190, Peoples R China.
中文摘要	Thermal design, finite element analysis of a satellite borne PCB is introduced in this paper. Some methods were adopted to help heat conduct and a simplified computing model was built. The analysis results show that the temperature scope of the main structure is from 45.5 degrees C to 72.3 degrees C in high temperature work case and all of junction temperatures of components are lower than the derated maximum junction temperatures themselves and leave enough design margins, which match the requirements of thermal analysis.
英文摘要	Thermal design, finite element analysis of a satellite borne PCB is introduced in this paper. Some methods were adopted to help heat conduct and a simplified computing model was built. The analysis results show that the temperature scope of the main structure is from 45.5 degrees C to 72.3 degrees C in high temperature work case and all of junction temperatures of components are lower than the derated maximum junction temperatures themselves and leave enough design margins, which match the requirements of thermal analysis.
收录类别	EI ; CPCI
会议主办者	Guangxi Univ, Guilin Univ Elect Technol, Univ Wollongong, Korea Maritime Univ, Hong Kong Ind Technol Res Ctr
会议录	ADVANCES IN MECHANICAL DESIGN, PTS 1 AND 2
会议录出版者	TRANS TECH PUBLICATIONS LTD
会议录出版地	STAFA-ZURICH
学科主题	微波遥感
语种	英语
ISSN号	1022-6680
ISBN号	978-3-03785-037-4
内容类型	会议论文
源URL	[http://ir.nssc.ac.cn/handle/122/3336]
专题	国家空间科学中心_微波遥感部
推荐引用方式 GB/T 7714	Chen, Bo. Thermal Design and Analysis of a Satellite Borne Electronic PCB[C]. 见:2nd International Conference on Manufacturing Science and Engineering. Guilin, PEOPLES R CHINA. APR 09-11, 2011.