Thermal Design, Analysis and Experimental Verification of a Satellite Borne Electronic Equipment

	Thermal Design, Analysis and Experimental Verification of a Satellite Borne Electronic Equipment
	Chen, Bo
	2011
会议名称	International Conference on Advances in Materials and Manufacturing Processes
会议日期	NOV 06-08, 2010
会议地点	Shenzhen, PEOPLES R CHINA
关键词	Thermal simulation Thermal analysis Finite element analysis CAD Derated maximum junction temperature
页码	611-614
通讯作者	Chen, B (reprint author), Chinese Acad Sci, Ctr Space Sci & Appl Res, Beijing 100190, Peoples R China.
中文摘要	Thermal design, finite element analysis and experiment verification of a satellite borne power amplifier are introduced in this paper. Some methods were adopted to help heat conduct and a simplified computing model was built. The analysis results show that the temperature scope of the main structure is from 45.3 degrees C to 50.7 degrees C in high temperature work case and -9.7 degrees C to -4.3 degrees C in low temperature work case, and all of junction temperatures of components with high heat power consumption are lower than the derated maximum junction temperatures themselves and leave enough design margins. The experimental results show that the computing values are very close to experimental values and the largest error is 1.9 degrees C, which proved that the simplification of model and the values of computing parameters are reasonable. Thermal analysis with reasonable model simplification and computing parameters would be helpful for production design.
英文摘要	Thermal design, finite element analysis and experiment verification of a satellite borne power amplifier are introduced in this paper. Some methods were adopted to help heat conduct and a simplified computing model was built. The analysis results show that the temperature scope of the main structure is from 45.3 degrees C to 50.7 degrees C in high temperature work case and -9.7 degrees C to -4.3 degrees C in low temperature work case, and all of junction temperatures of components with high heat power consumption are lower than the derated maximum junction temperatures themselves and leave enough design margins. The experimental results show that the computing values are very close to experimental values and the largest error is 1.9 degrees C, which proved that the simplification of model and the values of computing parameters are reasonable. Thermal analysis with reasonable model simplification and computing parameters would be helpful for production design.
收录类别	EI ; CPCI
会议主办者	Univ Wollongong, NE Univ, Univ Sci & Technol Beijing, Hebei Polytechn Univ, Hong Kong Ind Technol Res Ctr
会议录	ADVANCED MANUFACTURING TECHNOLOGY, PTS 1, 2
会议录出版者	TRANS TECH PUBLICATIONS LTD
会议录出版地	STAFA-ZURICH
学科主题	微波遥感
语种	英语
ISSN号	1022-6680
ISBN号	978-0-87849-205-3
内容类型	会议论文
源URL	[http://ir.nssc.ac.cn/handle/122/3337]
专题	国家空间科学中心_微波遥感部
推荐引用方式 GB/T 7714	Chen, Bo. Thermal Design, Analysis and Experimental Verification of a Satellite Borne Electronic Equipment[C]. 见:International Conference on Advances in Materials and Manufacturing Processes. Shenzhen, PEOPLES R CHINA. NOV 06-08, 2010.