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浏览/检索结果: 共13条，第1-10条 帮助 限定条件 专题：华南理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Corrosion properties of high-strength nanocrystalline Al84Ni7Gd6Co3alloy produced by hot pressing of metallic glass (EI收录) 期刊论文 Journal of Alloys and Compounds, 2017, 卷号: 707, 页码: 63-67 作者:  Wang, Z.[1,2];  Scudino, S.[3];  Prashanth, K.G.[4];  Eckert, J.[4,5] 收藏  |  浏览/下载：7/0  |  提交时间：2019/04/24 Aluminum  Cobalt compounds  Corrosion  Corrosion resistance  Electrochemical corrosion  Glass  Hot pressing  Intermetallics  Metallic glass  Nanocrystalline alloys  Nanocrystals  Nickel  Pitting  Pressing (forming)   Microstructure and mechanical property of Al-5.0Cu-1.0Fe alloy treated by compound field (EI收录) 期刊论文 Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, 2016, 卷号: 26, 页码: 707-714 作者:  Luo, Zhi[1];  Zhang, Yang[1];  Zhao, Yu-Liang[1];  Zhang, Wei-Wen[1] 收藏  |  浏览/下载：109/0  |  提交时间：2019/04/24 Aluminum  Copper alloys  Hardness  Intermetallics  Mechanical properties  Microstructure  Porosity  Pressure effects  Scanning electron microscopy  Tungsten  Tungsten compounds   Effect of Nano-TiO2particles on growth of interfacial Cu6Sn5and Cu3Sn layers in Sn-3.0Ag-0.5Cu-xTiO2solder joints (EI收录SCI收录) 期刊论文 Journal of Alloys and Compounds, 2016, 卷号: 684, 页码: 299-309 作者:  Tang, Y.[1];  Luo, S.M.[1];  Wang, K.Q.[1];  Li, G.Y.[2] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/24 Activation energy  Chemical activation  Copper compounds  Diffusion  Energy dispersive spectroscopy  Grain boundaries  Grain growth  Intermetallics  Lead  free solders  Scanning electron microscopy  Silver  Soldered joints  Soldering alloys  Titanium dioxide  X ray diffraction  X ray spectroscopy   Method of arc-assisted laser wire welding-brazing between aluminum and galvanized steel with filler powder (EI收录) 期刊论文 Zhongguo Jiguang/Chinese Journal of Lasers, 2016, 卷号: 43 作者:  Li, Chunling[1,2];  Fan, Ding[2];  Yu, Xiaoquan[2];  Yu, Shurong[1] 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/24 Alloy steel  Brazing  Dissimilar metals  Filler metals  Fillers  Fracture  Fracture testing  Galvanizing  Grain boundaries  Intermetallics  Iron compounds  Mechanical properties  Powder metals  Scanning electron microscopy  Silicon  Tensile strength  Welding  Welds  Wire   Formation of Fe-rich intermetallic compounds and their effect on the tensile properties of squeeze-cast Al-Cu alloys (EI收录SCI收录) 期刊论文 Journal of Materials Research, 2015, 卷号: 30, 页码: 2474-2484 作者:  Zhang, Wei-Wen[1];  Lin, Bo[1,2];  Luo, Zhi[1];  Zhao, Yu-Liang[1];  Li, Yuan-Yuan[1] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/25 Aluminum  Aluminum alloys  Copper alloys  Die casting  Energy conservation  Intermetallics  Iron compounds  Manganese  Phase transitions  Squeeze casting   Improved steel/aluminum bonding in bimetallic castings by a compound casting process (EI收录) 期刊论文 Journal of Materials Processing Technology, 2015, 卷号: 226, 页码: 25-31 作者:  Jiang, Wenming[1,2];  Fan, Zitian[1];  Li, Chi[1] 收藏  |  浏览/下载：9/0  |  提交时间：2019/04/25 Aluminum  Aluminum coatings  Bonding  Carbon  Carbon steel  Coatings  Die casting inserts  Intermetallics  Iron compounds  Steel  Surface treatment   Effect of ultrasonic vibration and applied pressure on the microstructure and mechanical property of Al-5.0Cu-0.6Mn-0.6Fe alloys (EI收录) 会议 Guiyang, China, 作者:  Zhao, Yuliang[1];  Zhang, Yang[1];  Luo, Zhi[1];  Wang, Zhi[2];  Zhang, Weiwen[1] 收藏  |  浏览/下载：13/0  |  提交时间：2019/04/11 Aluminum  Aluminum alloys  Characterization  Copper alloys  Grain refinement  Grain size and shape  Intermetallics  Iron compounds  Manganese  Mechanical properties  Microstructure  Pressure effects  Solidification  Squeeze casting  Ultrasonic effects  Ultrasonic waves   Effect of nano-dopant on intermetallic compounds growth in Sn-3.0Ag-0.5Cu-xBi solder joints during aging process (EI收录) 会议论文 Proceedings of the Electronic Packaging Technology Conference, EPTC, Chengdu, China, August 12, 2014 - August 15, 2014 作者:  Tang, Y.[1,2];  Zhou, B.[3];  Huang, J.H.[1];  Wu, Z.Z.[1];  Li, G.Y.[1] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/12 Bismuth compounds  Copper compounds  Electronics packaging  Grain boundaries  Intermetallics  Lead  free solders  Microstructural evolution  Scanning electron microscopy  Silver  Soldered joints  Tin   Poisoning effect of combined addition of Fe and Mn on carbon inoculation of Mg-3% Al alloy (EI收录) 会议论文 Advanced Materials Research, Kunming, China, December 28, 2011 - December 29, 2011 作者:  Wang, Minghua[1];  Du, Jun[1];  Li, Wenfang[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/15 Aluminum  Biotechnology  Carbon  Catalyst poisoning  Cerium alloys  Grain refinement  Intermetallics  Iron  Manganese  Manganese compounds   The influence of electromigration and aging on the reliability of SnAgCu lead-free solder joint at 100°C (EI收录) 会议论文 ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, August 8, 2011 - August 11, 2011 作者:  Wei, Guoqiang[1];  Yao, Jian[1];  Shi, Yonghua[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15 Aging of materials  Electric currents  Electromigration  Electronics packaging  Fracture  Intermetallics  Lead compounds  Packaging  Scanning electron microscopy  Soldering alloys  Tensile strength  Tensile testing