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Real-time observation of phase coexistence and a1/a2 to flux-closure domain transformation in ferroelectric films 会议论文
作者:  Ma, J.Y.;  Wang, Y.J.;  Zhu, Y.L.;  Tang, Y.L.;  Han, M.J.
收藏  |  浏览/下载：15/0  |  提交时间：2020/12/18
CFD simulation of pressure wave propagation in the helium coolant tube break accident of DFLL-TBM 会议论文
Kyoto, JAPAN, SEP 25-29, 2017
作者:  Sun, Qian;  Peng, Tianji;  Zhou, Zhiwei;  Chen, Zhibin;  Wang, Shisheng
收藏  |  浏览/下载：33/0  |  提交时间：2019/03/27
Piezoceramic Smart Washer Enabled Bolt Pre-Load Monitoring Using Impedance Method 会议论文
EARTH AND SPACE 2018: ENGINEERING FOR EXTREME ENVIRONMENTS, 2018-01-01
作者:  Chen, Dongdong;  Huo, Linsheng;  Song, Gangbing
收藏  |  浏览/下载：11/0  |  提交时间：2019/12/02
Development of a Novel Mixed Sulfide-Iodide Lead-Free Bismuth Perovskite 会议论文
PHYSICAL CHEMISTRY OF SEMICONDUCTOR MATERIALS AND INTERFACES XVII, 2018-01-01
作者:  Zhang, Chu;  Teo, Siowhwa;  Gao, Liguo;  Yusuke, Kamata;  Ma, Tingli
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/02
Effect of Ag element on microstructure and mechanical properties of Sn-Bi-xAg solders designed by cluster-plus-glue-atom model 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Ren, Jing;  Huang, Mingliang;  Yang, Xudong
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/02
Mechanism of Cu5Zn8 layer act as a diffusion barrier layer 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Yao, Jinye;  Li, Hua;  Huang, Ru;  Qi, Xiao;  Wang, Boyin
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/02
High-quality lead sulfide nanofilm deposited on silica fiber substrate by atomic layer deposition technology 会议论文
NANOPHOTONICS AND MICRO/NANO OPTICS IV, 2018-01-01
作者:  Pan, Xiangping[1];  Dong, Yanhua[2];  Wen, Jianxiang[3];  Zheng, Jiajia[4];  Su, Caiyun[5]
收藏  |  浏览/下载：5/0  |  提交时间：2019/04/22
Clustering Data Gathering Method Based on Compressed Sensing in Wireless Sensor Networks 会议论文
Proceedings - 2018 10th International Conference on Intelligent Human-Machine Systems and Cybernetics, IHMSC 2018
作者:  Wang, N.;  Chen, D.;  Chen, J.;  Xu, X.;  Wan, J.
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/30
Effect of rapid inducted heating on the microstructure of solder joint in IC 会议论文
19th International Conference on Electronic Packaging Technology (ICEPT), Inst Microelectron Chinese Acad Sci, Shanghai, PEOPLES R CHINA, AUG 08-11, 2018
作者:  Chen, Jibing*;  Wan, Nong;  Li, Juying;  He, Zhanwen;  Wu, Yiping
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/27

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