CORC

在结果中检索

CORC

浏览/检索结果: 共28条，第1-10条 帮助

限定条件    
已选(0)清除 条数/页：   排序方式：
Electrical measurement and analysis of TSV/RDL for 3D integration 其他
2014-01-01
Sun, Xin; Fang, Runiu; Zhu, Yunhui; Zhong, Xiao; Bian, Yuan; Ma, Shenglin; Miao, Min; Chen, Jing; Wang, Yan; Jin, Yufeng
收藏  |  浏览/下载：4/0  |  提交时间：2015/11/17
A Wafer Level Through-Stack-Via Integration Process with One-time Bottom-up Copper Filling 其他
2014-01-01
Zhu, Yunhui; Ma, Shenglin; Sun, Xin; Fang, Runiu; Zhong, Xiao; Bian, Yuan; Guan, Yong; Chen, Jing; Miao, Min; Jin, Yufeng
收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03
Low-frequency Testing of Through Silicon Vias for Defect Diagnosis in Three-dimensional Integration Circuit Stacking Technology 其他
2014-01-01
Xu, Yichao; Miao, Min; Fang, Runiu; Sun, Xin; Zhu, Yunhui; Sun, Minggang; Wang, Guanjiang; Jin, Yufeng
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
Investigation of a TSV-RDL In-line Fault-Diagnosis System and Test Methodology for Wafer-level Commercial Production 其他
2014-01-01
Fang, Runiu; Miao, Min; Sun, Xin; Zhu, Yunhui; Wang, Guanjiang; Xu, Yichao; Sun, Minggang; Jin, Yufeng
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03
Electrical Simulation and Analysis of Si Interposer for 3D IC Integration 其他
2014-01-01
Sun, Xin; Miao, Min; Zhu, Yunhui; Fang, Runiu; Wang, Guanjiang; Lu, Wengao; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03
Development and Characterization of a Through-Multilayer TSV Integrated SRAM Module 其他
2013-01-01
Zhu, Yunhui; Ma, Shenglin; Sun, Xin; Fang, Runiu; Zhong, Xiao; Bian, Yuan; Chen, Meng; Chen, Jing; Miao, Min; Lu, Wengao; Jin, Yufeng
收藏  |  浏览/下载：8/0  |  提交时间：2015/11/16
Investigations of Silicon Wafer Bonding Using Thin Al and Sn Films for Heterogeneous Integration 其他
2013-01-01
Zhu, Zhiyuan; Wang, Shaonan; Xu, Yichao; Wang, Guanjiang; Pi, Yudan; Wang, Peiquan; Zhu, Yunhui; Sun, Xin; Yu, Min; Chen, Jing; Miao, Min; Jin, Yufeng
收藏  |  浏览/下载：5/0  |  提交时间：2015/11/13
Design and Process Development of a Stacked SRAM Memory Chip Module with TSV Interconnection 其他
2012-01-01
Ma, Shenglin; Sun, Xin; Zhu, Yunhui; Zhu, Zhiyuan; Cui, Qinghu; Chen, Meng; Xiao, Yongqiang; Chen, Jing; Miao, Min; Lu, Wengao; Jin, Yufeng
收藏  |  浏览/下载：4/0  |  提交时间：2015/11/16
Process Development and Characterization of BCB-based Redistribution Layer (RDL) for Silicon Interposer Application 其他
2012-01-01
Sun, Xin; Cui, Qinghu; Zhu, Yunhui; Ma, Shenglin; Chen, Jing; Miao, Min; Jin, Yufeng
收藏  |  浏览/下载：3/0  |  提交时间：2015/11/16
A TSV Last Integration Approach with Wafer Level Pre-patterned Adhesive Bonding 其他
2012-01-01
Zhu, Yunhui; Ma, Shenglin; Sun, Xin; Cui, Qinghu; Zhong, Xiao; Bian, Yuan; Chen, Jing; Miao, Min; Jin, Yufeng
收藏  |  浏览/下载：2/0  |  提交时间：2015/11/16

©版权所有 ©2017 CSpace - Powered by CSpace