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浏览/检索结果: 共6条，第1-6条 帮助 限定条件 内容类型：会议论文     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 In situ study the effects of Cu addition on the rapidly growth of Cu6Sn5 at the Sn-base solder/Cu L-S interface during soldering heat preservation stage 会议论文 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01 作者:  Guo, Bingfeng;  Jiang, Chengrong;  Kunwar, Anil;  Chen, Jun;  Zhao, Ning 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03 Synchrotron radiation  heat preservation stage  microstructure  Cu addition  mechanism   Effect of Ag concentration on the Cu6Sn5 growth in Sn-based solder/Cu joints at the isothermal reflow stage 会议论文 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01 作者:  Guo, Bingfeng;  Jiang, Chengrong;  Kunwar, Anil;  Zhao, Ning;  Chen, Jun 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03 high pressure air  synchrotron radiation  microstructure  Ag concentration  growth activity energy  mechanism   In situ study of real-time growth behavior of IMC morphology evolution during the Sn/Cu soldering cooling stage 会议论文 17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16 作者:  Guo, Bingfeng;  Jiang, Chengrong;  Kunwar, Anil;  Zhao, Ning;  Ma, Haitao 收藏  |  浏览/下载：9/0  |  提交时间：2019/12/09 morphology evolution  synchrotron radiation real-time imaging  high pressure air  partition phenomenon  copper precipitation   Positive Feedback on Imposed Thermal Gradient by Interfacial Bubbles in Cu/liquid Sn-3.5Ag/Cu Joints 会议论文 17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16 作者:  Kunwar, Anil;  Ma, Haoran;  Qi, Meng;  Sun, Junhao;  Qu, Lin 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/09 Soldering  Synchrotron radiation  Intermetallic compounds  Thermal conductivity  Finite element analysis   The morphology variation of IMC on the solder/bubble interface under different cooling rates and temperatures 会议论文 17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16 作者:  Ma, Haoran;  Kunwar, Anil;  Meng, Zhixian;  Guo, Bingfeng;  Zhao, Ning 收藏  |  浏览/下载：7/0  |  提交时间：2019/12/09 bubbles  cooling rate  gas/solid interface  intermetallic compounds  growth orientation  diffusion  SEM   Effects of Soldering Temperature and Cooling Rate on the as-Soldered Microstructures of Intermetallic Compounds in Sn-0.7Cu/Cu Joint 会议论文 16 int conf elect packaging technology, Chinese Inst Elect,China IEEE Component Packaging, & Mfg Tech Soci IEEE-C, Changsha, PEOPLES R CHINA, 2015-08-11 作者:  Guo, Bingfeng;  Kunwar, Anil;  Ma, Haoran;  Liu, Jiahui;  Li, Shuang 收藏  |  浏览/下载：6/0  |  提交时间：2019/12/09 IMC  morphology  cooling  temperature  synchrotron radiation